Vacuum processing chamber with controlled gas supply valve
Abstract
An apparatus for and a method of introducing a gas into a vacuum processing chamber are provided. In one aspect, a processing apparatus is provided that includes a vacuum processing chamber, a first source of gas coupled to the vacuum processing chamber, and a fluid actuated valve for regulating the flow of the gas from the first source of gas to the vacuum processing chamber. The fluid actuated valve is operable to open in response to a flow of an actuating fluid and has a minimum valve opening pressure. A valve is provided for enabling the actuating fluid to flow to the fluid actuated valve. A controller is provided for selectively modulating the flow of the actuating fluid to the fluid actuated valve whereby the pressure of the actuating fluid is increased incrementally from an initial pressure to at least the minimum valve opening pressure. The apparatus reduces the risk of troublesome gas bursts in vacuum processing chambers.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A processing apparatus, comprising:
a vacuum processing chamber;
a first source of gas coupled to the vacuum processing chamber;
a fluid actuated valve for regulating the flow of the gas from the first source of gas to the vacuum processing chamber, the fluid actuated valve being operable to open in response to a flow of an actuating fluid and having a minimum valve opening pressure; and
means configured to selectively modulate the flow of the actuating fluid to the fluid actuated valve whereby the pressure of the actuating fluid is increased incrementally from an initial pressure to at least the minimum valve opening pressure.
2. The processing apparatus of claim 1 , wherein the means for selectively modulating the flow of the actuating fluid comprises a valve for controlling the flow of the actuating fluid and a controller for selectively controlling the actuation of the valve, the controller being operable to rapidly cycle the valve open and shut during a time interval to enable the pressure of the actuating fluid acting on the fluid actuated valve to be increased incrementally.
3. The processing apparatus of claim 2 , wherein the controller comprises a computer.
4. The processing apparatus of claim 2 , wherein the controller comprises an integrated circuit.
5. The processing apparatus of claim 4 , wherein the integrated circuit comprises an oscillator for cycling power to the valve on and off.
6. The processing apparatus of claim 2 , comprising a pressure regulator coupled to the valve for maintaining the pressure of the actuating fluid below a preselected maximum.
7. The processing apparatus of claim 1 , wherein the fluid actuated valve comprises a spring biased bellows valve.
8. The processing apparatus of claim 1 , comprising a mass flow controller coupled to the fluid actuated valve for restricting the flow of gas from the source of gas.
9. The processing apparatus of claim 1 , wherein the actuating fluid comprises a gas.
10. The processing apparatus of claim 1 , wherein the processing chamber comprises a chemical vapor deposition chamber.
11. A processing apparatus, comprising:
a vacuum processing chamber;
a first source of gas coupled to the vacuum processing chamber;
a fluid actuated valve for regulating the flow of the gas from the first source of gas to the vacuum processing chamber, the fluid actuated valve being operable to open in response to a flow of an actuating fluid and having a minimum valve opening pressure;
a valve for enabling the actuating fluid to flow to the fluid actuated valve; and
a controller for selectively modulating the flow of the actuating fluid to the fluid actuated valve whereby the pressure of the actuating fluid is increased incrementally from an initial pressure to at least the minimum valve opening pressure.
12. The processing apparatus of claim 11 , wherein the controller comprises a computer.
13. The processing apparatus of claim 11 , wherein the controller comprises an integrated circuit.
14. The processing apparatus of claim 13 , wherein the integrated circuit comprises an oscillator for cycling power to the valve on and off.
15. The processing apparatus of claim 11 , comprising a pressure regulator coupled to the valve for maintaining the pressure of the actuating fluid below a preselected maximum.
16. The processing apparatus of claim 11 , wherein the fluid actuated valve comprises a spring biased bellows valve.
17. The processing apparatus of claim 11 , comprising a mass flow controller coupled to the fluid actuated valve for restricting the flow of gas from the source of gas.
18. The processing apparatus of claim 11 , wherein the actuating fluid comprises a gas.
19. The processing apparatus of claim 11 , wherein the processing chamber comprises a chemical vapor deposition chamber.
20. A processing apparatus, comprising:
a vacuum processing chamber;
a first source of gas coupled to the vacuum processing chamber;
a pressure sensor to sense the pressure in the vacuum processing chamber and being operable to generate an output signal indicative of the pressure sensed;
a fluid actuated valve for regulating the flow of the gas from the first source of gas to the vacuum processing chamber, the fluid actuated valve being operable to open in response to a flow of an actuating fluid and having a minimum valve opening pressure;
a valve for enabling the actuating fluid to flow to the fluid actuated valve; and
a controller for selectively modulating the flow of the actuating fluid to the fluid actuated valve in response to the output signal from the pressure sensor whereby the pressure of the actuating fluid is increased incrementally from an initial pressure to at least the minimum valve opening pressure.
21. The processing apparatus of claim 20 , wherein the controller comprises a computer.
22. The processing apparatus of claim 20 , wherein the controller comprises an integrated circuit.
23. The processing apparatus of claim 22 , wherein the integrated circuit comprises an oscillator for cycling power to the valve on and off.
24. The processing apparatus of claim 20 , wherein the actuating fluid comprises a gas.
25. The processing apparatus of claim 20 , wherein the processing chamber comprises a chemical vapor deposition chamber.Cited by (0)
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