Lithographically defined optic array

Abstract

A two-dimensional lithographically defined optic array to transmit light through a substrates and aid alignment of multiple substrates. The 2-D lithographically defined optic array tan be made up of transparent material filled vias. Additionally, markers can be placed on the substrates relative to either the vias or the optical centers of the transparent material in the vias to aid alignment between multiple substrates containing 2-D lithographically defined optic arrays. Transparent materials such as optical fiber, cladding, and gas may be used in the 2-D optic array to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate with a 2-D optic array. The conductive layer can then interact with the 2-D optic array through light detecting devices such as photodetectors.

I claim:  
     
       1. An optic array comprising: 
       a substrate with a plurality of holes;  
       at least two optical fibers each embedded in separate ones of said holes; and  
       a lithographically defined marker disposed on said substrate relative to said separate ones of said holes.  
     
     
       2. The optic array of  claim 1 , wherein said marker is a solder bump. 
     
     
       3. The optic array of  claim 1 , wherein said marker is a metal pad. 
     
     
       4. The optic array of  claim 1 , wherein said marker is a hole in the substrate. 
     
     
       5. The optic array of  claim 1 , wherein said substrate is made of silicon. 
     
     
       6. The optic array of  claim 1  further comprising a vertical cavity surface emitting laser aligned with said optical fiber. 
     
     
       7. The optic array of  claim 1 , wherein said marker is placed on said substrate relative to an optical fiber core. 
     
     
       8. A method of making an optic array comprising: 
       forming a plurality of holes in a substrate;  
       heating said substrate;  
       inserting at least two optical fibers each into a separate one of said holes; and  
       placing a lithographically defined marker on said substrate relative to said separate said holes.  
     
     
       9. The method of  claim 8 , wherein said plurality of holes is formed by etching. 
     
     
       10. The method of  claim 8 , wherein said substrate is ablatable. 
     
     
       11. The method of  claim 10 , wherein said plurality of holes is formed by a laser. 
     
     
       12. The method of  claim 8 , wherein said substrate is heated between approximately 75° C. to 175° C. 
     
     
       13. The method of  claim 8 , further comprising annealing a polymer over the substrate hole. 
     
     
       14. The method of  claim 8 , wherein said marker is a solder bump. 
     
     
       15. The method of  claim 8 , wherein said marker is placed on said substrate relative to an optical fiber core. 
     
     
       16. The method of  claim 8 , further comprising stacking two or more substrates. 
     
     
       17. The method of  claim 16 , further comprising aligning said substrates by aligning said markers. 
     
     
       18. A method of making a multi-hip module with an optic array comprising: 
       etching a hole in a first substrate;  
       heating said first substrate;  
       inserting an optical fiber into said substrate hole;  
       placing a first marker on said first substrate;  
       placing a second marker on a second substrate;  
       lithographically aligning said first marker with said second marker; and  
       attaching said first substrate to said second substrate.  
     
     
       19. The method of  claim 18 , further comprising annealing a polymer over the substrate hole. 
     
     
       20. The method of  claim 18 , wherein said aligning comprises: 
       placing a solder bump on said first substrate relative to said substrate hole;  
       placing a metal pad on said second substrate;  
       moving said first substrate and said second substrate relative to each other to  
       contact said solder bump to said metal pad; and  
       melting said solder bump to said metal pad.  
     
     
       21. The method of  claim 18 , wherein said aligning comprises: 
       placing a solder bump on said first substrate relative to a first substrate optical fiber core;  
       placing a metal pad on said second substrate;  
       moving said first substrate and said second substrate relative to each other to contact said solder bump to said metal pad; and  
       melting said solder bump to said metal pad.  
     
     
       22. The method of  claim 18 , wherein said aligning comprises: 
       etching a marker hole in said first substrate relative to said first substrate hole;  
       etching a marker hole in said second substrate;  
       moving said first substrate and said second substrate relative to each other until a source of electromagnetic radiation radiates through said first substrate marker hole and said second substrate marker hole; and  
       detecting said source of electromagnetic radiation with a detector of electromagnetic radiation.  
     
     
       23. The method of  claim 18 , wherein said aligning comprises: 
       etching a marker hole in said first substrate relative to a first substrate optic fiber core;  
       etching a marker hole in said second substrate;  
       moving said first substrate and said second substrate relative to each other until a source of electromagnetic radiation radiates through said first substrate marker hole and said second substrate marker hole; and  
       detecting said source of electromagnetic radiation with a detector of electromagnetic radiation.