Inventor
MURALI VENKATESAN
US49 patents
⚠️ This page may combine multiple inventors who share the name “MURALI VENKATESAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
25 patentsUS6687427B2Feb 3, 2004
Optic switch
INTEL CORP297 citations99
US6650817B2Nov 18, 2003
Multi-level waveguide
INTEL CORP32 citations96
US5492235AFeb 20, 1996
Process for single mask C4 solder bump fabrication
INTEL CORP112 citations95
US5047367ASep 10, 1991
Process for formation of a self aligned titanium nitride/cobalt silicide bilayer
INTEL CORP138 citations95
US6331446B1Dec 18, 2001
Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state
INTEL CORP25 citations92
US6219910B1Apr 24, 2001
Method for cutting integrated circuit dies from a wafer which contains a plurality of solder bumps
INTEL CORP20 citations92
US4966868AOct 30, 1990
Process for selective contact hole filling including a silicide plug
INTEL CORP49 citations91
US7066657B2Jun 27, 2006
Optical subassembly
INTEL CORP38 citations90
US6450699B1Sep 17, 2002
Photonic and electronic components on a shared substrate
INTEL CORP29 citations90
US6265300B1Jul 24, 2001
Wire bonding surface and bonding method
INTEL CORP35 citations89
US5567981AOct 22, 1996
Bonding pad structure having an interposed rigid layer
INTEL CORP40 citations89
US6819836B2Nov 16, 2004
Photonic and electronic components on a shared substrate with through substrate communication
INTEL CORP14 citations84
US7141448B2Nov 28, 2006
Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials
INTEL CORP17 citations83
US6248951B1Jun 19, 2001
Dielectric decal for a substrate of an integrated circuit package
INTEL CORP17 citations82
US6278185B1Aug 21, 2001
Semi-additive process (SAP) architecture for organic leadless grid array packages
INTEL CORP19 citations79
US7000434B2Feb 21, 2006
Method of creating an angled waveguide using lithographic techniques
INTEL CORP9 citations74
US6731843B2May 4, 2004
Multi-level waveguide
INTEL CORP9 citations74
US6633707B1Oct 14, 2003
Lithographically defined optic array
INTEL CORP8 citations74
US7095937B2Aug 22, 2006
Multi-level waveguide
INTEL CORP3 citations63
US6869882B2Mar 22, 2005
Method of creating a photonic via using deposition
INTEL CORP6 citations63
US6788836B2Sep 7, 2004
Multi-level waveguide
INTEL CORP2 citations63
US6650823B1Nov 18, 2003
Method of creating a photonic via using fiber optic
INTEL CORP5 citations63
US6928216B2Aug 9, 2005
Markings for aligning fiber optic bundle
INTEL CORP4 citations60
US6778727B2Aug 17, 2004
Optic switch
INTEL CORP0 citations52
US6636671B2Oct 21, 2003
Markings for aligning fiber optic bundle
INTEL CORP0 citations50
MERLIN SOLAR TECH INC
7 patentsUS11349040B2May 31, 2022
Photovoltaic cell having a coupled expanded metal article
MERLIN SOLAR TECH INC0 citations61
US11588064B2Feb 21, 2023
Method for blackening a metallic article
MERLIN SOLAR TECH INC0 citations59
US10886424B2Jan 5, 2021
Method for blackening a metallic article
MERLIN SOLAR TECH INC0 citations59
US10672927B2Jun 2, 2020
Photovoltaic cell having a coupled expanded metal article
MERLIN SOLAR TECH INC0 citations50
US10181542B2Jan 15, 2019
Photovoltaic cell having a coupled expanded metal article
MERLIN SOLAR TECH INC0 citations40
US10411152B2Sep 10, 2019
Solar cell bonding
MERLIN SOLAR TECH INC0 citations36
US11558010B2Jan 17, 2023
Method for blackening an electrical conduit
MERLIN SOLAR TECH INC0 citations34
MURALI VENKATESAN
6 patentsUS8101451B1Jan 24, 2012
Method to form a device including an annealed lamina and having amorphous silicon on opposing faces
MURALI VENKATESAN13 citations82
US8785294B2Jul 22, 2014
Silicon carbide lamina
MURALI VENKATESAN4 citations71
US8629061B2Jan 14, 2014
Method for three-dimensional packaging of electronic devices
MURALI VENKATESAN5 citations71
US8871608B2Oct 28, 2014
Method for fabricating backside-illuminated sensors
MURALI VENKATESAN0 citations51
US8841161B2Sep 23, 2014
Method for forming flexible solar cells
MURALI VENKATESAN0 citations47
US8916954B2Dec 23, 2014
Multi-layer metal support
MURALI VENKATESAN0 citations36
GTAT CORP
4 patentsUS8569096B1Oct 29, 2013
Free-standing metallic article for semiconductors
GTAT CORP20 citations91
US8916038B2Dec 23, 2014
Free-standing metallic article for semiconductors
GTAT CORP6 citations82
US8936709B2Jan 20, 2015
Adaptable free-standing metallic article for semiconductors
GTAT CORP6 citations71
US8940998B2Jan 27, 2015
Free-standing metallic article for semiconductors
GTAT CORP1 citations50