Method for probing an electrical device having a layer of oxide thereon

Abstract

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

What is claimed is:  
     
       1. A method for probing an electrical device having a layer of oxide thereon, comprising the steps of: 
       (a) providing a contact having an elongate ridge having a pair of inclined surfaces defining an acute angle therebetween;  
       (b) electrically connecting said elongate ridge of said contact to a testing device;  
       (c) pressing said ridge into pressing engagement with said electrical device;  
       (d) removing said oxide surface away from said ridge;  
       (e) penetrating said ridge into said electrical device in such a manner that said contact has a tilting motion so as to drive said contact in accordance with said tilting motion into lateral scrubbing movement across said electrical device;  
       (f) testing said electrical device using said testing device.  
     
     
       2. The method of  claim 1  wherein said pair of inclined sides join. 
     
     
       3. The method of  claim 1  further comprising the step of providing a stopping surface on said contact. 
     
     
       4. The method of  claim 1  further comprising the step of providing another elongate ridge on said contact. 
     
     
       5. The method of  claim 4  wherein said ridges are parallel. 
     
     
       6. The method of  claim 4  wherein said ridges are perpendicular. 
     
     
       7. The method of  claim 1  further comprising the step of forming an arch with said contact. 
     
     
       8. The method of  claim 7  wherein said ridge is located at an end of said arch. 
     
     
       9. The method of  claim 1  wherein said electrical pad is a solder bump.