Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same

Abstract

The invention includes polymers that contain a heterocyclic ring, preferably an oxygen- or sulfur-containing ring. The heterocyclic ring is preferably fused to the polymer backbone. The invention also provides photoresists that contain such polymers, particularly for imaging at short wavelengths such as sub-200 nm.

1. A photoresist comprising a photoactive component and a polymer that comprises: i) a heteroalicyclic group that does not contain a carbonyl ring member and is fused to the polymer backbone and that contains one or more oxygen or sulfur ring atoms; ii) a carbon alicyclic group fused to the polymer backbone; and iii) polymerized acrylate that comprises a photoacid-labile moiety. 
     
     
       2. The photoresist of  claim 1  wherein the heteroalicyclic group has an oxygen ring member. 
     
     
       3. The photoresist of  claim 1  wherein the heteroalicyclic group has a sulfur ring member. 
     
     
       4. The photoresist of  claim 1  wherein the carbon alicyclic group is a polymerized norbornene group. 
     
     
       5. The photoresist of  claim 1  wherein the heteroalicyclic group has a non-hydrogen ring substituent. 
     
     
       6. The photoresist of  claim 1  wherein the polymer is a tetrapolymer or pentapolymer. 
     
     
       7. The photoresist of  claim 1  wherein the polymer is completely free of aromatic groups. 
     
     
       8. The photoresist of  claim 1  wherein the photoacid-labile moiety is a substituent of the heteroalicyclic group or carbon alicyclic group. 
     
     
       9. The photoresist of  claim 1  wherein the photoacid-labile moiety is a polymer unit distinct from the heteroalicyclic group and carbon alicyclic group. 
     
     
       10. The photoresist of  claim 1  wherein the polymer further comprises lactone or anhydride units. 
     
     
       11. The photoresist of  claim 1  wherein the polymer further comprises polymerized maleic anhydride groups. 
     
     
       12. The photoresist of  claim 1  wherein the heteroalicyclic group fused to the polymer backbone does not contain an unsaturated oxygen. 
     
     
       13. The photoresist of  claim 1  wherein the heteroalicyclic group fused to the polymer backbone does not contain an unsaturated sulfur. 
     
     
       14. The photoresist composition of  claim 1  wherein the polymer is at least substantially free of aromatic groups. 
     
     
       15. The photoresist composition of  claim 1  wherein the heteroalicyclic group is not an anhydride or lactone. 
     
     
       16. The photoresist composition of  claim 1  wherein the heteroalicyclic group contains a single ring oxygen atom. 
     
     
       17. An article of manufacture comprising a microelectronic wafer substrate or a flat panel display substrate having coated thereon a layer of a photoresist composition of  claim 1 . 
     
     
       18. A method of forming a positive photoresist relief image, comprising:
 (a) applying a coating layer of a photoresist of  claim 1  on a substrate; and 
 (b) exposing and developing the photoresist image to yield a relief image. 
 
     
     
       19. The method of  claim 18  wherein the photoresist layer is exposed with radiation having a wavelength of less than about 200 nm. 
     
     
       20. The method of  claim 18  wherein the photoresist layer is exposed with radiation having a wavelength of about 193 nm.