Test method for semiconductor components using anisotropic conductive polymer contact system

Abstract

A contact system for electrically engaging semiconductor components includes an interface board mountable to an automated test handler, and a floating substrate on the interface board. The interface board includes interface contacts in electrical communication with external test circuitry. The substrate includes flexible segments, and contactors having contact pads on opposing sides of the flexible segments configured to simultaneously electrically engage terminal contacts on the components, and the interface contacts on the interface board. The contact pads include conductive polymer layers that provide an increased compliancy for the contactors. This increased compliancy allows the contactors to accommodate variations in the dimensions and planarity of the terminal contacts on the component. In addition, the substrate includes grooves between the contactors which provide electrical isolation and allow the contactors to move independently of one another. An alternate embodiment contact system includes a Z-axis conductive polymer layer between the substrate and the interface board. Also provided are test methods employing the contact systems.

1. A method for testing a semiconductor component having a plurality of terminal contacts comprising:
 providing a board comprising a plurality of contacts in electrical communication with a test circuitry; 
 providing a substrate configured to float on the board comprising a plurality of flexible segments configured to move independently of one another; 
 providing a plurality of movable test contactors on the substrate comprising first contacts on first side of the flexible segments configured to electrically engage the terminal contacts and second contacts on second opposing sides of the flexible segments in electrical communication with the first contacts, and a resilient anisotropic conductive polymer layer configured to electrically engage the second contacts and the contacts; 
 placing the component on the substrate with the first contacts electrically contacting the terminal contacts using movement of the first contacts, and the second contacts electrically contacting the contacts using a resiliency of the anisotropic conductive polymer layer; and 
 applying test signals through the test contactors and the terminal contacts to the component. 
 
   
   
     2. The method of  claim 1  wherein the flexible segments include conductive vias electrically connecting the first contacts and the second contacts. 
   
   
     3. The method of  claim 1  further comprising applying a force to the component during the placing step. 
   
   
     4. The method of  claim 1  wherein the substrate is configured to float on the board on guide pins. 
   
   
     5. The method of  claim 1  wherein the terminal contacts comprise an element selected from the group consisting of leads, bumps and pads. 
   
   
     6. The method of  claim 1  wherein the placing step is performed using a test handler. 
   
   
     7. A method for testing a semiconductor component having a terminal contact comprising:
 providing a board comprising at least one contact in electrical communication with test circuitry; 
 providing a substrate configured to slide on the board comprising a flexible segment and at least one contactor configured to simultaneously electrically engage the contact and the terminal contact, the contactor comprising a first contact on a first side of the flexible seament configured to electrically engage the terminal contact, a second contact on a second side of the flexible segment in electrical communication with the first contact, and a resilient anisotropic conductive polymer layer configured to electrically engage the second contact and the contact; 
 placing the component on the board with the first contact free to move to make electrical contact with the terminal contact, and with the second contact using a resiliency of the anisotropic conductive polymer layer to make electrical contact with the contact; and 
 applying test signals through the terminal contact, the contact, the second contact, and the anisotropic conductive polymer layer to the component. 
 
   
   
     8. The method of  claim 7  wherein the substrate is configured to slide in a Z-direction on the board. 
   
   
     9. The method of  claim 7  wherein the flexible segment includes a conductive via electrically connecting the first contact and the second contact. 
   
   
     10. The method of  claim 7  wherein the terminal contact comprises an element selected from the group consisting of leads, bumps and pads. 
   
   
     11. The method of  claim 7  wherein the component comprises an element selected from the group consisting of packages, BGA devices and modules. 
   
   
     12. A method for testing a semiconductor component having a plurality of terminal contacts comprising:
 providing a board comprising a plurality of contacts in electrical communication with test circuitry; 
 providing a floating substrate on the board; 
 providing a plurality of test contactors on the substrate, each test contactor comprising a flexible segment on the substrate, a first contact on a first side of the flexible segment configured to electrically engage a terminal contact, a second contact on a second opposing side of the flexible segment in electrical communication with the first contact, and a resilient anisotropic conductive polymer configured to electrically engage the second contact and a contact on the board; 
 placing the component on the substrate with the test contactors free to move in a z-direction to make electrical contact with the terminal contacts, and with the anisotropic conductive polymer providing resiliency for making contact with the contacts on the board; and 
 applying test signals through the test contactors and the terminal contacts to the component. 
 
   
   
     13. The method of  claim 12  wherein each test contactor includes a conductive via in the flexible segment electrically connecting the first contact and the second contact. 
   
   
     14. The method of  claim 12  wherein the anisotropic conductive polymer comprises an elastomeric base material and a plurality of conductive particles in the base material. 
   
   
     15. The method of  claim 12  wherein the test contactors move independently in the z-direction during the placing step. 
   
   
     16. The method of  claim 12  wherein the placing step is performed using a test handler. 
   
   
     17. The method of  claim 12  wherein the substrate comprises an opening and the board comprises a pin for physically engaging the opening.