Inventor
CRAM DANIEL P
US45 patents
⚠️ This page may combine multiple inventors who share the name “CRAM DANIEL P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
41 patentsUS6624653B1Sep 23, 2003
Method and system for wafer level testing and burning-in semiconductor components
MICRON TECHNOLOGY INC216 citations99
US6856151B1Feb 15, 2005
Conductive polymer contact system and test method for semiconductor components
MICRON TECHNOLOGY INC51 citations96
US6462575B1Oct 8, 2002
Method and system for wafer level testing and burning-in semiconductor components
MICRON TECHNOLOGY INC53 citations96
US6462568B1Oct 8, 2002
Conductive polymer contact system and test method for semiconductor components
MICRON TECHNOLOGY INC64 citations96
US7114976B2Oct 3, 2006
Test socket and test system for semiconductor components with easily removable nest
MICRON TECHNOLOGY INC16 citations92
US6998862B2Feb 14, 2006
Test socket for semiconductor components having serviceable nest
MICRON TECHNOLOGY INC21 citations92
US6888364B2May 3, 2005
Test system and test contactor for electronic modules
MICRON TECHNOLOGY INC25 citations92
US6825685B2Nov 30, 2004
Method and system for wafer level testing and burning-in semiconductor components
MICRON TECHNOLOGY INC20 citations92
US6756802B2Jun 29, 2004
Test system for electronic modules having contactors with spring segment terminal portions
MICRON TECHNOLOGY INC24 citations92
US6741091B2May 25, 2004
Test method for electronic modules using contractors and conductive polymer contacts
MICRON TECHNOLOGY INC19 citations92
US6727715B2Apr 27, 2004
Test system and test contactor for electronic modules having beam spring contacts
MICRON TECHNOLOGY INC28 citations92
US6489794B1Dec 3, 2002
High speed pass through test system and test method for electronic modules
MICRON TECHNOLOGY INC27 citations92
US6483329B1Nov 19, 2002
Test system, test contactor, and test method for electronic modules
MICRON TECHNOLOGY INC27 citations92
US7176702B2Feb 13, 2007
Contact system for wafer level testing
MICRON TECHNOLOGY INC10 citations84
US7043388B2May 9, 2006
System and apparatus for testing packaged devices and related methods
MICRON TECHNOLOGY INC15 citations84
US7514945B2Apr 7, 2009
Systems configured for utilizing semiconductor components
MICRON TECHNOLOGY INC8 citations83
US7456504B2Nov 25, 2008
Electronic component assemblies with electrically conductive bonds
MICRON TECHNOLOGY INC5 citations74
US7279915B2Oct 9, 2007
Test method for electronic modules using movable test contactors
MICRON TECHNOLOGY INC4 citations74
US7135345B2Nov 14, 2006
Methods for processing semiconductor devices in a singulated form
MICRON TECHNOLOGY INC8 citations74
US7126228B2Oct 24, 2006
Apparatus for processing semiconductor devices in a singulated form
MICRON TECHNOLOGY INC7 citations74
US7122389B2Oct 17, 2006
Method for processing semiconductor devices in a singulated form
MICRON TECHNOLOGY INC5 citations74
US7123036B2Oct 17, 2006
Test method for electronic modules
MICRON TECHNOLOGY INC6 citations74
US7093622B2Aug 22, 2006
Apparatus for deforming resilient contact structures on semiconductor components
MICRON TECHNOLOGY INC7 citations74
US6966424B2Nov 22, 2005
Bladder based package control/singulation
MICRON TECHNOLOGY INC8 citations74
US8011092B2Sep 6, 2011
Methods of providing semiconductor components within sockets
MICRON TECHNOLOGY INC4 citations73
US7439752B2Oct 21, 2008
Methods of providing semiconductor components within sockets
MICRON TECHNOLOGY INC4 citations73
US7425839B2Sep 16, 2008
Systems and methods for testing packaged microelectronic devices
MICRON TECHNOLOGY INC8 citations73
US7265563B2Sep 4, 2007
Test method for semiconductor components using anisotropic conductive polymer contact system
MICRON TECHNOLOGY INC3 citations63
US7038475B2May 2, 2006
Test method for semiconductor components using conductive polymer contact system
MICRON TECHNOLOGY INC2 citations63
US6585097B2Jul 1, 2003
Bladder based package control/singulation
MICRON TECHNOLOGY INC3 citations63
US12499957B2Dec 16, 2025
Thermal conduction based batch testing system
MICRON TECHNOLOGY INC0 citations62
US7857646B2Dec 28, 2010
Electrical testing apparatus having masked sockets and associated systems and methods
MICRON TECHNOLOGY INC4 citations62
US7586319B2Sep 8, 2009
Methods of retaining semiconductor component configurations within sockets
MICRON TECHNOLOGY INC3 citations62
US7918383B2Apr 5, 2011
Methods for placing substrates in contact with molten solder
MICRON TECHNOLOGY INC2 citations59
US7541825B2Jun 2, 2009
Isolation circuit
MICRON TECHNOLOGY INC2 citations59
US7570069B2Aug 4, 2009
Resilient contact probes
MICRON TECHNOLOGY INC3 citations58
US7427869B2Sep 23, 2008
Resilient contact probe apparatus
MICRON TECHNOLOGY INC3 citations58
US7121860B2Oct 17, 2006
Pinch-style support contact, method of enabling electrical communication with and supporting an IC package, and socket including same
MICRON TECHNOLOGY INC4 citations54
US7274197B2Sep 25, 2007
Contact system for interfacing a semiconductor wafer to an electrical tester
MICRON TECHNOLOGY INC1 citations52
US7692437B2Apr 6, 2010
Systems and methods for testing packaged microelectronic devices
MICRON TECHNOLOGY INC0 citations51
US8004297B2Aug 23, 2011
Isolation circuit
MICRON TECHNOLOGY INC0 citations49