Electronic component assemblies with electrically conductive bonds

Abstract

Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.

1. An electronic component assembly, comprising:
 an electronic component including a conductive element; 
 a substrate including a conductive element on a surface thereof connected to a conductive element on an opposing surface thereof; and 
 an electrically conductive bond comprising an at least partially solidified water-soluble mask material impregnated with a conductive filler of discrete particles joining the conductive element of the electronic component to the conductive element on the surface of the substrate. 
 
     
     
       2. The assembly of  claim 1 , wherein the conductive filler comprises discrete particles of a metal or metal alloy. 
     
     
       3. The assembly of  claim 1 , wherein the water-soluble mask material comprises a polymer or copolymer-based material. 
     
     
       4. The assembly of  claim 1 , wherein the electronic component comprises a semiconductor die in either packaged or bare form. 
     
     
       5. An electronic component assembly comprising:
 an electronic component including a conductive element; 
 a substrate including a conductive element on a surface thereof facing the electronic component connected to a conductive element on an opposing surface thereof; and 
 an electrically conductive bond comprising discrete particles of a metal or metal alloy entrained within a solidified flux carrier joining the conductive element of the electronic component and the conductive element on the surface of the substrate facing the electronic component. 
 
     
     
       6. The assembly of  claim 5 , wherein the electronic component comprises a semiconductor die in either packaged or bare form. 
     
     
       7. An electronic component assembly, comprising:
 a semiconductor device including at least one conductive I/O element; 
 a substrate including at least one conductive attachment pad in direct contact with the at least one conductive I/O element; and 
 an at least partially solidified, nonconductive water-soluble mask material bonding a peripheral edge of the semiconductor device to the substrate. 
 
     
     
       8. The assembly of  claim 7 , wherein the at least partially solidified,
 nonconductive water-soluble mask material extends substantially around a periphery of the semiconductor device.