Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same

Abstract

An integrated thin-film capacitor includes a dielectric disposed between a first electrode and a second electrode. The thin-film capacitor includes a dielectric disposed upon the first electrode, and the dielectric exhibits a substantially uniform heat-altered morphology along a line defined by a characteristic dimension thereof. A computing system is also disclosed that includes the thin-film capacitor.

What is claimed is: 
     
       1. A process comprising:
 ejecting a fluid in a pattern above a first electrode, wherein the pattern is one of a positive pattern and a negative pattern; 
 treating the fluid to stabilize the positive pattern or to destabilize the negative pattern; and 
 mating the first electrode with a second electrode such that the positive pattern is disposed between the first electrode and the second electrode. 
 
     
     
       2. The process of  claim 1 , wherein ejecting the fluid is preceded by forming a ceramic powder film on the first electrode, the process further including:
 polymerizing the fluid in the positive pattern; and 
 removing the ceramic powder film that is disposed in the negative pattern. 
 
     
     
       3. The process of  claim 2 , wherein ejecting the fluid includes ejecting the fluid over the ceramic powder film, wherein the ceramic powder film has an average particle size range from about 20 nm to about 300 nm. 
     
     
       4. The process of  claim 2 , wherein ejecting the fluid is carried out by an ink-jet apparatus. 
     
     
       5. The process of  claim 1 , wherein the fluid is a dielectric solution or suspension, wherein ejecting the fluid achieves a fluid that is ejected into the positive pattern, and wherein treating includes heating the dielectric solution or suspension. 
     
     
       6. The process of  claim 5 , wherein ejecting includes ejecting a ceramic powder suspension, wherein the ceramic powder suspension has an average particle size range from about 20 nm to about 300 nm. 
     
     
       7. The process of  claim 1 , wherein the fluid is a dielectric solution or suspension, wherein ejecting the fluid achieves a fluid that is ejected into the positive pattern, and wherein treating includes at least one of calcining and sintering the dielectric solution or suspension. 
     
     
       8. The process of  claim 7 , wherein ejecting is carried out by an ink-jet apparatus. 
     
     
       9. The process of  claim 1 , further including:
 forming a ceramic powder film on the first electrode before ejecting the fluid, wherein the fluid is ejected into the negative pattern, the process further including: 
 polymerizing the ceramic powder film such that the fluid hinders polymerization in the negative pattern; and 
 removing the ceramic powder film that is disposed in the negative pattern. 
 
     
     
       10. The process of  claim 9 , wherein ejecting includes ejecting the fluid over the ceramic powder film, wherein the ceramic powder film has an average particle size range from about 20 nm to about 300 nm. 
     
     
       11. The process of  claim 10 , wherein ejecting is carried out by an ink-jet apparatus.