Inventor · disambiguated record
Yongki Min
Also filed as: MIN YONGKI
28 granted patents·24 pending applications·123 citations·filing 2004–2023
96Inventor score
Top patents by PatentIndex Score
52 records- 0186US7435675B2Method of providing a pre-patterned high-k dielectric filmINTEL CORP·Filed 2006·Granted Oct 14, 2008·14 cites·30 claims
- 0285US7402909B2Microelectronic package interconnect and method of fabrication thereofINTEL CORP·Filed 2005·Granted Jul 22, 2008·12 cites·15 claims
- 0383US7572709B2Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitorINTEL CORP·Filed 2006·Granted Aug 11, 2009·9 cites·23 claims
- 0480US9911723B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2015·Granted Mar 6, 2018·3 cites·11 claims
- 0578US7553738B2Method of fabricating a microelectronic device including embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the methodINTEL CORP·Filed 2006·Granted Jun 30, 2009·9 cites·14 claims
- 0677US11581271B2Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrateINTEL CORP·Filed 2019·Granted Feb 14, 2023·2 cites·27 claims
- 0777US7710709B2Carbon nanotube coated capacitor electrodesINTEL CORP·Filed 2007·Granted May 4, 2010·7 cites·8 claims
- 0876US7687366B2Pre-patterned thin film capacitor and method for embedding same in a package substrateINTEL CORP·Filed 2006·Granted Mar 30, 2010·5 cites·13 claims
- 0976US7588992B2Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing sameINTEL CORP·Filed 2005·Granted Sep 15, 2009·6 cites·20 claims
- 1075US7727814B2Microelectronic package interconnect and method of fabrication thereofINTEL CORP·Filed 2008·Granted Jun 1, 2010·5 cites·14 claims
- 1175US7290315B2Method for making a passive device structureINTEL CORP·Filed 2004·Granted Nov 6, 2007·18 cites·18 claims
- 1274US8228680B2Embedding thin film resistors in substrates in power delivery networksMYAT MYITZU SOE·Filed 2010·Granted Jul 24, 2012·7 cites·11 claims
- 1373US8143697B2Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitorSEH HUANKIAT·Filed 2009·Granted Mar 27, 2012·5 cites·13 claims
- 1471US7525140B2Integrated thin film capacitors with adhesion holes for the improvement of adhesion strengthINTEL CORP·Filed 2005·Granted Apr 28, 2009·4 cites·13 claims
- 1571US7416938B2Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing sameINTEL CORP·Filed 2006·Granted Aug 26, 2008·4 cites·11 claims
- 1670US7983020B2Carbon nanotube coated capacitor electrodesINTEL CORP·Filed 2010·Granted Jul 19, 2011·1 cites·9 claims
- 1769US10340260B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2018·Granted Jul 2, 2019·1 cites·8 claims
- 1869US7705458B2Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing sameINTEL CORP·Filed 2006·Granted Apr 27, 2010·3 cites·23 claims
- 1968US7733626B2Passive device structureINTEL CORP·Filed 2007·Granted Jun 8, 2010·3 cites·17 claims
- 2066US8003479B2Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitorINTEL CORP·Filed 2006·Granted Aug 23, 2011·2 cites·21 claims
- 2165US10157860B2Component stiffener architectures for microelectronic package structuresINTEL CORP·Filed 2016·Granted Dec 18, 2018·1 cites·23 claims
- 2264US7738257B2Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making sameINTEL CORP·Filed 2006·Granted Jun 15, 2010·2 cites·12 claims
- 2358US10741536B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2019·Granted Aug 11, 2020·0 cites·10 claims
- 2458US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 2557US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 2657US2025218964A1Technologies for connected components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2757US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 2857US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2957US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3056US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3156US2014111924A1Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing sameSEH HUANKIAT·Filed 2013·Application pending·0 cites
- 3255US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3352US8618593B2Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitorSALAMA ISLAM A·Filed 2011·Granted Dec 31, 2013·0 cites·19 claims
- 3450US7838419B2Systems and methods to laminate passives onto substrateINTEL CORP·Filed 2006·Granted Nov 23, 2010·0 cites·5 claims
- 3549US7981758B2Systems and methods to laminate passives onto substrateINTEL CORP·Filed 2010·Granted Jul 19, 2011·0 cites·5 claims
- 3647US8623737B2Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing sameSEH HUANKIAT·Filed 2006·Granted Jan 7, 2014·0 cites·28 claims
- 3747US2007235500A1Room temperature joining process with piezoelectric ceramic-activated reactive multilayer foilSUH DAEWOONG·Filed 2006·Application pending·0 cites
- 3845US2006289976A1Pre-patterned thin film capacitor and method for embedding same in a package substrateINTEL CORP·Filed 2005·Application pending·0 cites
- 3944US2006220167A1IC package with prefabricated film capacitorINTEL CORP·Filed 2005·Application pending·0 cites
- 4044US2006228855A1Capacitor with co-planar electrodesINTEL CORP·Filed 2005·Application pending·0 cites
- 4143US11335616B2Substrate integrated inductor with composite magnetic resin layerINTEL CORP·Filed 2017·Granted May 17, 2022·0 cites·25 claims
- 4243US2008145622A1Polymer-based integrated thin film capacitors, packages containing same and methods related theretoROY MIHIR K·Filed 2006·Application pending·0 cites
- 4340US2007202655A1Method of providing a via opening in a dielectric film of a thin film capacitorINTEL CORP·Filed 2005·Application pending·0 cites
- 4439US2006099803A1Thin film capacitorMIN YONGKI·Filed 2004·Application pending·0 cites
- 4539US2006000542A1Metal oxide ceramic thin film on base metal electrodeMIN YONGKI·Filed 2004·Application pending·0 cites
- 4638US2020203470A1Magnetic mold material inductors for electronic packagesINTEL CORP·Filed 2018·Application pending·0 cites
- 4737US2006291174A1Embedding thin film resistors in substrates in power delivery networksMYAT MYITZU S·Filed 2005·Application pending·0 cites
- 4836US2020013533A1Magnetic solder mask on package substrate above magnetic inductor arrayINTEL CORP·Filed 2018·Application pending·0 cites
- 4936US2020005983A1Magnetic encapsulant for package magnetic inductorsINTEL CORP·Filed 2018·Application pending·0 cites
- 5035US2006176145A1Electronic substrates with thin-film resistors coupled to one or more relatively thick tracesINTEL CORP·Filed 2005·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →