Method of fabricating T-gate

Abstract

A method of fabricating a T-gate is provided. The method includes the steps of: forming a photoresist layer on a substrate; patterning the photoresist layer formed on the substrate and forming a first opening; forming a first insulating layer on the photoresist layer and the substrate; removing the first insulating layer and forming a second opening to expose the substrate; forming a second insulating layer on the first insulating layer; removing the second insulating layer and forming a third opening to expose the substrate; forming a metal layer on the second insulating layer on which the photoresist layer and the third opening are formed; and removing the metal layer formed on the photoresist layer. Accordingly, a uniform and elaborate opening defining the length of a gate may be formed by deposition of the insulating layer and a blanket dry etching process, and thus a more elaborate micro T-gate electrode may be fabricated.

1. A method of fabricating a T-gate, comprising the steps of:
 forming a photoresist layer on a substrate; 
 patterning the photoresist layer formed on the substrate and forming a first opening; 
 forming a first insulating layer on the photoresist layer and the substrate; 
 removing the first insulating layer and forming a second opening to expose the substrate; 
 forming a second insulating layer on the first insulating layer; 
 removing the second insulating layer and forming a third opening to expose the substrate; 
 forming a metal layer on the second insulating layer on which the photoresist layer and the third opening are formed; and 
 removing the metal layer formed on the photoresist layer. 
 
   
   
     2. The method according to  claim 1 , wherein the step of patterning the photoresist layer comprises the steps of exposing the photoresist layer so that the first opening has an inverse slope using a photolithography method, and developing the exposed photoresist layer. 
   
   
     3. The method according to  claim 1 , wherein the step of removing the metal layer formed on the photoresist layer is performed by removing the photoresist layer and the first and second insulating layers by a lift-off process. 
   
   
     4. The method according to  claim 1 , wherein the photoresist layer is formed of an image reversal photoresist layer. 
   
   
     5. The method according to  claim 4 , wherein the first opening formed in the photoresist layer is patterned to a width of about 1 μm or less. 
   
   
     6. The method according to  claim 1 , wherein the step of forming the second opening in the first insulating layer is performed by etching the first insulating layer by a reactive etching process. 
   
   
     7. The method according to  claim 1 , wherein the step of forming the third opening in the second insulating layer is performed by etching the second insulating layer by a reactive etching process.