Assembly including vertical and horizontal joined circuit panels

Abstract

An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

1. An assembly, comprising:
 (a) a first circuit panel having a top surface, and including:
 a first dielectric element, and 
 first conductive traces disposed on said first dielectric element; 
 
 (b) a second circuit panel having a bottom surface, and including:
 a second dielectric element, and 
 second conductive traces disposed on said second dielectric element, 
 at least a portion of said second circuit panel overlying at least a portion of said first circuit panel; and 
 
 (c) an interconnect circuit panel that includes a third dielectric element having a bottom end that abuts the top surface of the first circuit panel, a top end that abuts the bottom surface of the second circuit panel, a front surface extending between the top end and the bottom end, a rear surface opposite said front surface and extending between the top end and the bottom end, and a plurality of interconnect traces each one being respectively disposed on said front surface or said rear surface of said third dielectric element and contacting that surface, at least some of said first conductive traces of the first circuit panel being in electrically conductive communication with said second conductive traces of the second circuit panel through said interconnect traces. 
 
   
   
     2. An assembly as claimed in  claim 1  wherein said interconnect circuit panel includes an electrically conductive plane separated from said interconnect traces by said dielectric element. 
   
   
     3. An assembly as claimed in  claim 1  wherein said interconnect panel includes top contacts exposed at said top end, and bottom contacts exposed at said bottom end, at least some of said interconnect traces being connected to at least some of said top and bottom contacts, said first circuit panel having top terminals exposed at said top surface, said second circuit panel having bottom terminals exposed at said bottom surface, at least some of said bottom contacts being bonded to at least some of said top terminals, at least some of said top contacts being bonded to at least some of said bottom terminals. 
   
   
     4. An assembly as claimed in  claim 2  wherein said first circuit panel includes a first electrically conductive plane and said second circuit panel includes a second electrically conductive plane, wherein said first and second electrically conductive planes are in conductive communication with each other through said electrically conductive plane of said interconnect circuit panel. 
   
   
     5. An interconnect element, comprising:
 a dielectric element having a bottom surface, a top surface disposed opposite said bottom surface, a front surface extending between said top surface and said bottom surface, and a rear surface extending between said top surface and said bottom surfaces, said front surface being disposed opposite said rear surface; 
 a plurality of front conductive traces each being disposed on and contacting said front surface, said front conductive traces extending in a vertical direction between said top surface and said bottom surface; 
 at least one rear conductive element disposed on and contacting said rear surface, said at least one rear conductive element extending in a vertical direction between said top surface and said bottom surface; and 
 at least one of:
 a plurality of top contacts disposed on said top surface, said plurality of top contacts conductively connected to said front conductive traces and said at least one rear conductive element, or 
 a plurality of bottom contacts disposed on said bottom surface, said bottom contacts conductively connected to said front conductive traces and said at least one rear conductive element. 
 
 
   
   
     6. The interconnect element as claimed in  claim 5 , wherein said front surface defines a front plane, said rear surface defines a rear plane, said bottom surface defines a bottom plane and said top surface defines a top plane, said front plane intersecting at least one of said bottom plane and said top plane at an at least substantially right angle, said interconnect element further comprising a plurality of conductive lands having at least substantially planar portions disposed on said front surface in conductive communication with said front conductive traces. 
   
   
     7. The interconnect element as claimed in  claim 5 , wherein said dielectric element is a material selected from the group consisting of FR-4, BT resin, epoxy glass resin, and glass. 
   
   
     8. The interconnect element as claimed in  claim 6 , wherein said plurality of top contacts includes at least substantially planar top conductive traces extending in a direction of said top plane. 
   
   
     9. The interconnect element as claimed in  claim 6 , wherein said rear conductive element includes a plurality of rear conductive traces and said interconnect element further comprises a plurality of conductive lands having at least substantially planar portions disposed on said rear surface in conductive communication with said rear conductive traces. 
   
   
     10. The interconnect element as claimed in  claim 7 , wherein said top and bottom surfaces define top and bottom planes, respectively and said top and bottom contacts include metallized grooves oriented in directions of said top and bottom planes, respectively, said metallized grooves connected to said front conductive traces and said at least one rear conductive element. 
   
   
     11. The interconnect element as claimed in  claim 8 , wherein said plurality of top contacts includes top contact lands having at least substantially planar portions disposed on said top surface in conductive communication with said top conductive traces. 
   
   
     12. The interconnect element as claimed in  claim 10 , wherein said front surface defines a front plane, said rear surface defines a rear plane, said bottom surface defines a bottom plane and said top surface defines a top plane, said front plane intersecting at least one of said bottom plane and said top plane at an at least substantially right angle, said interconnect element further comprising a plurality of conductive lands having at least substantially planar portions disposed on said front surface in conductive communication with said front conductive traces. 
   
   
     13. The interconnect element as claimed in  claim 10 , wherein said at least one rear conductive element includes a ground plane covering said rear surface of said dielectric element. 
   
   
     14. The interconnect element as claimed in  claim 10 , wherein said at least one rear conductive element includes a plurality of vertically extending ground traces. 
   
   
     15. The interconnect element as claimed in  claim 10 , wherein said front and rear surfaces define front and rear planes, respectively, and said front, rear, top and bottom planes are each disposed substantially at right angles relative to respective adjoining ones of the front, rear, top and bottom planes. 
   
   
     16. The interconnect element as claimed in  claim 11 , wherein said at least some of said at least substantially planar portions abut an edge shared by said front surface and said top surface. 
   
   
     17. The interconnect element as claimed in  claim 12 , further comprising a plurality of conductive lands having at least substantially planar portions disposed on said rear surface, wherein said rear conductive element includes a plurality of rear conductive traces in conductive communication with said conductive lands. 
   
   
     18. The interconnect element as claimed in  claim 14 , further comprising at least one vertically extending power conductor disposed internally within said dielectric element. 
   
   
     19. The interconnect element as claimed in  claim 15 , wherein said front conductive traces and said at least one rear conductive element are disposed in vertically extending straight paths between said top and bottom surfaces. 
   
   
     20. The interconnect element as claimed in  claim 15 , wherein a plurality of rear conductive elements are disposed as conductive traces on said rear surface, and said interconnect element further comprises at least one ground conductor disposed internally within said dielectric element. 
   
   
     21. An assembly including the interconnect element as claimed in  claim 15 , said assembly further comprising a first circuit panel having a top surface and top terminals disposed on said top surface, wherein said bottom contacts of said interconnect element are conductively mounted to said top terminals. 
   
   
     22. The assembly as claimed in  claim 21 , wherein said bottom contacts of said interconnect element are conductively joined to said top terminals through at least one bond type selected from the group consisting of a fusible conductive medium, diffusion bond, and adhesive. 
   
   
     23. The assembly as claimed in  claim 21 , wherein first ones of said top terminals are offset in two horizontal directions from second ones of said top terminals along said top surface of said first circuit panel, said first ones conductively connected to said front contacts, and said second ones conductively connected to said at least one rear conductive element. 
   
   
     24. The assembly as claimed in  claim 21 , further comprising a second circuit panel having a bottom surface and bottom terminals disposed on said bottom surface, wherein said top contacts of said interconnect element are conductively mounted to said bottom terminals of said second circuit panel. 
   
   
     25. The assembly as claimed in  claim 21 , further comprising a second circuit panel having top and bottom surfaces and a side surface disposed between said top and bottom surfaces of said second circuit panel, said second circuit panel having side terminals disposed on said side surface, wherein said front conductive traces of said interconnect element are conductively mounted to said side terminals of said second circuit panel. 
   
   
     26. The assembly as claimed in  claim 24 , wherein said second circuit panel includes a thermally conductive slab, said assembly further comprising a chip mounted to said second circuit panel.