Inventor · disambiguated record
Ronald Green
Also filed as: GREEN RONALD · GREEN RONALD E
8 granted patents·4 pending applications·140 citations·filing 2004–2023
86Inventor score
Top patents by PatentIndex Score
12 records- 0193US7489524B2Assembly including vertical and horizontal joined circuit panelsTESSERA INC·Filed 2005·Granted Feb 10, 2009·40 cites·26 claims
- 0292US7176043B2Microelectronic packages and methods thereforTESSERA INC·Filed 2004·Granted Feb 13, 2007·69 cites·54 claims
- 0383US7545029B2Stack microelectronic assembliesTESSERA INC·Filed 2006·Granted Jun 9, 2009·13 cites·49 claims
- 0481US7554206B2Microelectronic packages and methods thereforTESSERA INC·Filed 2006·Granted Jun 30, 2009·9 cites·13 claims
- 0572US7855623B2Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductorTESSERA INC·Filed 2007·Granted Dec 21, 2010·5 cites·27 claims
- 0665US2023415278A1Welders' cart and methodGREEN RONALD E·Filed 2023·Application pending·0 cites
- 0759US10560464B2Systems and methods for identifying electronic messages containing malicious contentMASTERCARD INTERNATIONAL INC·Filed 2016·Granted Feb 11, 2020·1 cites·19 claims
- 0854US7583165B2High Q cavity resonators for microelectronicsTESSERA INC·Filed 2005·Granted Sep 1, 2009·2 cites·30 claims
- 0953US7332799B2Packaged chip having features for improved signal transmission on the packageTESSERA INC·Filed 2005·Granted Feb 19, 2008·1 cites·17 claims
- 1041US2007138612A1Stackable electronic device assembly and high G-force test fixtureTESSERA INC·Filed 2006·Application pending·0 cites
- 1140US2008105963A1Stackable electronic device assemblyTESSERA INC·Filed 2007·Application pending·0 cites
- 1238US2005258529A1High-frequency chip packagesTESSERA INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →