Apparatus for translated wafer stand-in tester

Abstract

A translated wafer stand-in tester (TWST), being a hybrid apparatus capable of emulating the form factor and some or all behaviors of a translated wafer under test, which is operable to store, quantify, encode and convey, either directly or remotely, data from a testing system, including but not limited to pad pressure, electrical contact and temperature. The TWST may include several stacked and attached layers, at least one internal layer including electronic components operable to interact with a test system.

1. An electronic assembly suitable for testing and calibrating a wafer level test system, comprising:
 a substrate having a plurality of electronic components and a plurality of contacts disposed on a first major surface thereof; 
 a spacer board having a plurality of cut-outs therein, the spacer board disposed superjacent the substrate; and 
 a tester interface connection board disposed superjacent the spacer board; 
 wherein the cut-outs in the spacer board are configured to provide openings by means of which the spacer board may pass those electronic components and be in physical contact with at least a portion of the plurality of contacts on the substrate; and wherein the tester interface connection board includes contacts on each of two opposite major surfaces thereof, at least a portion of the contacts on a first of the two major surfaces electrically connected to a corresponding portion of the contacts of a second of the two major surfaces, and at least a portion of the electrical contacts of the spacer board are in electrical contact with the electrical contacts of the surface of the tester interface connection board that faces the spacer board. 
 
     
     
       2. The electronic assembly of  claim 1 , wherein the plurality of electronic components includes data storage devices. 
     
     
       3. The electronic assembly of  claim 1 , wherein the plurality of electronic components includes data storage devices, and temperature sensor devices. 
     
     
       4. The electronic assembly of  claim 1 , wherein the plurality of electronic components includes logic devices, data storage devices, and pressure sensor devices. 
     
     
       5. The electronic assembly of  claim 1 , wherein the plurality of electronic components forms at least one wireless communication circuit.