Inventor

JOHNSON MORGAN T

US47 patents

⚠️ This page may combine multiple inventors who share the name “JOHNSON MORGAN T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JOHNSON MORGAN T

ADVANCED INQUIRY SYSTEMS INC

Wafer translator having a silicon core isolated from signal paths by a ground plane

Apparatus for translated wafer stand-in tester

Methods for access to a plurality of unsingulated integrated circuits of a wafer using single-sided edge-extended wafer translator

Apparatus for providing electrical access to one or more pads of the wafer using a wafer translator and a gasket

Methods for multi-modal wafer testing using edge-extended wafer translator

Apparatus for full-wafer test and burn-in mechanism

Method and apparatus for single-sided extension of electrical conductors beyond the edges of a substrate

Methods and apparatus for planar extension of electrical conductors beyond the edges of a substrate

Wafer translator having metallization pattern providing high density interdigitated contact pads for component

Apparatus for fixed-form multi-planar extension of electrical conductors beyond the margins of a substrate

Methods and apparatus for flexible extension of electrical conductors beyond the edges of a substrate

Methods and apparatus for multi-modal wafer testing

Fiber-based optical alignment system

Fully tested wafers having bond pads undamaged by probing and applications thereof

Apparatus for thinning, testing and singulating a semiconductor wafer

Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Methods and apparatus for translated wafer stand-in tester

Full-wafer test and burn-in mechanism

Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon

Methods and apparatus for addition of electrical conductors to previously fabricated device

Fiber-based optical alignment system

Maintaining a wafer/wafer translator pair in an attached state free of a gasket diposed

Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed therebetween

Methods and apparatus for collecting process characterization data after first failure in a group of tested devices

JOHNSON MORGAN T

Selective application of conductive material to substrates by pick and place of compliant contact arrays

Methods and apparatus for thinning, testing and singulating a semiconductor wafer

Selective application of conductive material to circuit boards by pick and place

Wafer prober integrated with full-wafer contactor

Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon

Methods and apparatus for thinning, testing and singulating a semiconductor wafer

Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon

Full-water test and burn-in mechanism

Method and apparatus for multi-planar edge-extended wafer translator

TRANSLARITY INC

Wafer prober integrated with full-wafer contacter

Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed

Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods

Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods

(unassigned)

Reconfigurable circuit fabrication method

Method and apparatus for wafer scale testing

OCTAVIAN SCIENT INC

Full wafer contacter and applications thereof

Methods and apparatus for addition of electrical conductors to previously fabricated device

MORGAN MILLER TECHNOLOGIES LLC

Laser micromachining and electrical structures formed thereby

MORGAN LABS LLC

Method and apparatus for wafer scale testing

DURBIN AARON

Wafer testing systems and associated methods of use and manufacture

PROTOTYPE SOLUTIONS CORP

Multiple board package employing solder balis and fabrication method and apparatus

MORGAN CONNECTOR

Methods and apparatus for high performance electrical connections