Wafer level image module

Abstract

A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.

1. A wafer level image module comprising:
 a photo sensor for outputting an electrical signal upon receiving light; 
 a lens set for focusing incident light onto the photo sensor, said lens set having a focus offset; and 
 a transparent spacer and an overlying adjustment member comprising a glass fiber spacer disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set, such that the incident light passing through the lens set is focused onto the photo sensor in an in-focus manner without passing through the adjustment member, said adjustment member having a thickness equal to focus offset to thereby compensate for the focus offset and cause the lens set to focus said incident light onto the photo sensor. 
 
     
     
       2. The wafer level image module as claimed in  claim 1 , wherein the lens set comprises a first transparent lens layer bonded to the adjustment member, a second transparent lens layer, and a light transmissive pad sandwiched between the first transparent lens layer and the second transparent lens layer. 
     
     
       3. The wafer level image module as claimed in  claim 2 , wherein the lens set further comprises a light transmissive pad bonded to a top surface of the second transparent lens layer opposite to the light transmissive pad that is sandwiched between the first transparent lens layer and the second transparent lens layer. 
     
     
       4. The wafer level image module as claimed in  claim 1 , wherein said photo sensor is a complementary metal-oxide semiconductor type photo sensor. 
     
     
       5. The wafer level image module as claimed in  claim 1 , wherein said adjustment member is made by means of thick film photolithography technology.