Inventor

LEE HSIAO-WEN

TW106 patents

⚠️ This page may combine multiple inventors who share the name “LEE HSIAO-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HSIAO-WEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Multi-chip wafer level packages and methods of forming the same

Package structure and method for forming the same

Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image buffer

Semiconductor devices and methods of manufacturing thereof

Multi-chip packages and methods of forming the same

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Multi-chip packages

Integrated fan-out packaging

Semiconductor devices and methods of manufacturing thereof

Methods of forming multi-chip wafer level packages

Integrated fan-out packaging

Integrated fan-out packaging

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Non-planar transistor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

Package structure

Semiconductor devices and methods of manufacturing thereof

Semiconductor devices and methods of manufacturing thereof

IND TECH RES INST

MEMS differential actuated nano probe and method for fabrication

Light emitting diode package and process of making the same

Micro electromechanical differential actuator

Folding mirror structure

MEMS differential actuated nano probe and method for fabrication

MEMS optical switch with self-assembly structure

Optical switch

VISERA TECHNOLOGIES CO LTD

Optoelectronic device chip having a composite spacer structure and method making same

Method to optimize micro-optic lens in LED flashlight application

Alignment device and application thereof

Optoelectronic device chip having a composite spacer structure and method making same

LEE HSIAO-WEN

Light emitting diode with a micro-structure lens having a ridged surface

Refractive index tuning of wafer level package LEDs

TSENG CHI XIANG

Wide angle based indoor lighting lamp

Micro-structure phosphor coating

TSMC SOLID STATE LIGHTING LTD

Method and apparatus for fabricating phosphor-coated LED dies

Method and apparatus for packaging phosphor-coated LEDs

AHEAD OPTOELECTRONICS INC

Intergrating sphere ellipsometer

TSENG CHI-XIANG

Method and apparatus for fabricating phosphor-coated LED dies

SUN CHIH-HSUAN

Light-emitting diode lamp and method of making

UNIV NAT SUN YAT SEN

Fiber used in wideband amplified spontaneous emission light source and the method of making the same