Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same

Abstract

A wiring board is provided with an external connection terminal to which an electrode terminal of an electronic component is to be connected. The external connection terminal is formed so that a portion thereof is electrically connected to a pad portion exposed from an outermost insulating layer on an electronic component mounting surface of a wiring board body and so that an air gap is kept between a portion of the external connection terminal, to which the electrode terminal of the electronic component is to be connected, and the insulating layer.

1. A method of manufacturing a wiring board, comprising:
 fabricating a wiring board body including a pad portion formed on an electronic component mounting surface thereof; 
 forming a sacrificial layer having any one of a line shape and a dot shape in a plan view and having any one of a trapezoidal shape and a semicircular shape in a cross-sectional view, in a desired portion of an insulating layer formed on the electronic component mounting surface of the wiring board body; 
 forming a plated wiring to form an external connection terminal to be connected to the pad portion, on the sacrificial layer; and 
 removing the sacrificial layer. 
 
     
     
       2. The method according to  claim 1 , wherein the plated wiring is formed by electroplating using metal which improves elasticity, as a plating seed. 
     
     
       3. The method according to  claim 1 , wherein the plated wiring is formed so as to have a cross wiring pattern in a plan view. 
     
     
       4. A method of manufacturing an electronic component device, comprising:
 fabricating a wiring board body including a pad portion formed on an electronic component mounting surface thereof; 
 forming a sacrificial layer having any one of a line shape and a dot shape in a plan view and having any one of a trapezoidal shape and a semicircular shape in a cross-sectional view, in a desired portion of an insulating layer formed on the electronic component mounting surface of the wiring board body; 
 forming a plated wiring to form an external connection terminal to be connected to the pad portion, on the sacrificial layer; 
 mounting an electronic component by connecting an electrode terminal thereof to the plated wiring via a conductive bump; and 
 removing the sacrificial layer.