Photosensitive molecular compound and photoresist composition including the same

Abstract

Disclosed are a photosensitive compound containing oxime group which is directly decomposed by exposure to light, which is a molecular resist whose size is smaller than conventional polymer for photoresist, and a photoresist composition including the same. The photosensitive molecular compound has a structure represented by a following formula. In Formula, R 1 is hydrogen atom or methyl group (CH 3 ); R a and R b each is independently alkyl group of 1-6 carbon atoms, alkylcarbonyl group of 2-7 carbon atoms, aryl group of 6-10 carbon atoms or arylcarbonyl group of 7-11 carbon atoms, and R a and R b form one group as an united body, alkyl or cycloalkyl group of 1-20 carbon atoms or arylalkyl group of 7-20 carbon atoms which are doubly bonded to nitrogen atom.

The invention claimed is: 
     
       1. A photosensitive molecular compound having a structure of the following Formula 1, 
       
         
           
           
               
               
           
         
         in Formula 1, R 1  is hydrogen atom or methyl group (CH 3 ); wherein 
         i) R a  and R b  each is independently alkyl group of 1-6 carbon atoms, alkylcarbonyl group of 2-7 carbon atoms, aryl group of 6-10 carbon atoms or arylcarbonyl group of 7-11 carbon atoms, or 
         ii) R a  and R b  are combined as a single group which is doubly bonded to nitrogen atom, and wherein said single group is an alkyl or cycloalkyl group of 1-20 carbon atoms or arylalkyl group of 7-20 carbon atoms, or 
         iii) R a  and R b  each is independently alkyl group of 1-6 carbon atoms, alkylcarbonyl group of 2-7 carbon atoms, aryl group of 6-10 carbon atoms or arylcarbonyl group of 7-11 carbon atoms and wherein R a  and R b  combine with the nitrogen atom to form a ring. 
       
     
     
       2. The photosensitive molecular compound of  claim 1 , wherein R a  and R b  are coupled to each other to form a ring structure. 
     
     
       3. The photosensitive molecular compound of  claim 1 , wherein said photosensitive molecular compound is selected from a group consisting of 
       
         
           
           
               
               
           
         
         
           
           
               
               
           
         
         
           
           
               
               
           
         
       
     
     
       4. A photosensitive molecular compound having the following structure 
       
         
           
           
               
               
           
         
       
     
     
       5. A photoresist composition comprising:
 1 to 85 wt % (weight %) of photosensitive molecular compound having a structure of the following Formula 1, 
 
       
         
           
           
               
               
           
         
         in Formula 1, R 1  is hydrogen atom or methyl group (CH 3 ); wherein 
         i) R a  and R b  each is independently alkyl group of 1-6 carbon atoms, alkylcarbonyl group of 2-7 carbon atoms, aryl group of 6-10 carbon atoms or arylcarbonyl group of 7-11 carbon atoms, or 
         ii) R a  and R b  are combined as a single group which is doubly bonded to nitrogen atom, and wherein said single group is an alkyl or cycloalkyl group of 1-20 carbon atoms or arylalkyl group of 7-20 carbon atoms, or 
         iii) R a  and R b  each is independently alkyl group of 1-6 carbon atoms, alkylcarbonyl group of 2-7 carbon atoms, aryl group of 6-10 carbon atoms or arylcarbonyl group of 7-11 carbon atoms and wherein R a  and R b  combine with the nitrogen atom to form a ring; and 
         a remaining organic solvent. 
       
     
     
       6. The photoresist composition of  claim 5 , further comprising 0.01 to 10 weight parts of a base compound with respect to 100 weight parts of the photosensitive molecular compound, wherein, the base compound is selected from a group of consisting of tri-ethylamine, tri-octylamine, tri-iso-butylamine, tri-iso-octylamine, di-ethanolamine, tri-ethanolamine and mixture thereof. 
     
     
       7. A method for forming a photoresist pattern, comprising the step of:
 a) coating a photoresist composition on a substrate to form a photoresist layer; 
 b) exposing the photoresist layer to a light; 
 c) heating the exposed photoresist layer; and 
 d) developing the heated photoresist layer to form the photoresist pattern,
 wherein the photoresist composition comprises i) 1 to 85 wt % (weight %) of photosensitive molecular compound having a structure of the following Formula 1, 
 
 
       
         
           
           
               
               
           
         
         in Formula 1, R 1  is hydrogen atom or methyl group (CH 3 ); wherein 
         A) R a  and R b  each is independently alkyl group of 1-6 carbon atoms, alkylcarbonyl group of 2-7 carbon atoms, aryl group of 6-10 carbon atoms or arylcarbonyl group of 7-11 carbon atoms, or 
         B) R a  and R b  are combined as a single group which is doubly bonded to nitrogen atom, and wherein said single group is an alkyl or cycloalkyl group of 1-20 carbon atoms or arylalkyl group of 7-20 carbon atoms, or 
         C) R a  and R b  each is independently alkyl group of 1-6 carbon atoms, alkylcarbonyl group of 2-7 carbon atoms, aryl group of 6-10 carbon atoms or arylcarbonyl group of 7-11 carbon atoms and wherein R a  and R b  combine with the nitrogen atom to form a ring; and 
         ii) an organic solvent.