Integrated circuit system with sealring and method of manufacture thereof

Abstract

A method of manufacture an integrated circuit system includes: forming an insulation region in a base layer; filling an insulator in the insulation region around a perimeter of a main chip region; forming a contact directly on and within planar extents of the insulator; and forming an upper layer over the contact to protect the main chip region.

1. A method of manufacture of an integrated circuit system comprising:
 forming an insulation region in a base layer; 
 filling an insulator in the insulation region wherein the insulator is over an active portion and around a perimeter of a main chip region including an integrated circuit; 
 forming a contact directly on and within planar extents of the insulator in the insulation region; and 
 forming at least one sealring having an upper layer over active portion and the contact with the sealring surrounding and isolating an active surface area in the main chip region. 
 
     
     
       2. The method as claimed in  claim 1  further comprising:
 forming a first active portion next to a side of the insulation region; and 
 forming a second active portion next to another side of the insulation region. 
 
     
     
       3. The method as claimed in  claim 1  further comprising:
 forming a first active portion adjacent a vertical side of the contact; and 
 forming a second active portion adjacent another vertical side of the contact. 
 
     
     
       4. The method as claimed in  claim 1  further comprising forming a first active portion adjacent the insulation region, the first active portion having a plane of a top side substantially aligned to a plane of a bottom side of the contact. 
     
     
       5. The method as claimed in  claim 1  further comprising:
 forming an active portion adjacent the insulation region and wherein forming at least one of the sealring includes: 
 forming a sealring adjacent the side of the active portion; and 
 forming another of the sealring adjacent another side of the active portion. 
 
     
     
       6. A method of manufacture of an integrated circuit system comprising:
 forming an insulation region and a first active portion in a base layer, the insulation region adjacent the first active portion; 
 filling an insulator in the insulation region wherein the insulator is entirely around a perimeter of a main chip region including an integrated circuit; 
 forming a contact directly on and within planar extents of the insulator in the insulation region; 
 forming a layer one directly on the contact; 
 forming an upper via over the layer one; 
 forming at least one sealring having an upper layer directly on the upper via with the sealring surrounding and isolating an active surface area in the main chip region; and 
 forming a passivation layer directly on the upper layer. 
 
     
     
       7. The method as claimed in  claim 6  wherein:
 forming the first active portion includes forming the first active portion next to a side of the insulation region, the first active portion having a spacing from the contact; and 
 
       further comprising:
 forming a second active portion next to another side of the insulation region, the second active portion having a spacing from the contact. 
 
     
     
       8. The method as claimed in  claim 6  wherein:
 forming the first active portion includes forming the first active portion adjacent the contact, the first active portion having a vertical side substantially parallel to a vertical side of the contact; and 
 
       further comprising:
 forming a second active portion adjacent the contact, the second active portion having a vertical side substantially parallel to another vertical side of the contact. 
 
     
     
       9. The method as claimed in  claim 6  wherein forming the first active portion includes forming the first active portion adjacent the contact, the first active portion having a plane of a top side substantially aligned to a plane of a bottom side of the contact. 
     
     
       10. The method as claimed in  claim 6  further comprising forming an active portion adjacent the insulation region formed as a shallow trench isolation, the active portion having a side adjacent the sealring and another side adjacent another of the sealring. 
     
     
       11. An integrated circuit system comprising:
 an insulation region in a base layer; 
 an insulator in the insulation region wherein the insulator is over an active portion and around a perimeter of a main chip region including an integrated circuit; 
 a contact directly on and within planar extents of the insulator in the insulation region; and 
 at least one sealring having an upper layer over the contact with the sealring surrounding and isolating an active surface area in the main chip region. 
 
     
     
       12. The system as claimed in  claim 11  further comprising:
 a first active portion next to a side of the insulation region; and 
 a second active portion next to another side of the insulation region. 
 
     
     
       13. The system as claimed in  claim 11  further comprising:
 a first active portion adjacent a vertical side of the contact; and 
 a second active portion adjacent another vertical side of the contact. 
 
     
     
       14. The system as claimed in  claim 11  further comprising a first active portion adjacent the insulation region, the first active portion having a plane of a top side substantially aligned to a plane of a bottom side of the contact. 
     
     
       15. The system as claimed in  claim 11  further comprising:
 an active portion adjacent the insulation region; and wherein at least one of the sealring includes: 
 the sealring adjacent a side of the active portion; and 
 another of the sealring adjacent another side of the active portion. 
 
     
     
       16. The system as claimed in  claim 11  further comprising:
 a first active portion in the base layer, the insulation region adjacent the first active portion and entirely around the perimeter of the main chip region; 
 a layer one directly on the contact; 
 an upper via over the layer one; and 
 a passivation layer directly on the upper layer, the upper layer directly on the upper via. 
 
     
     
       17. The system as claimed in  claim 16  wherein:
 the first active portion includes the first active portion next to a side of the insulation region, the first active portion having a spacing from the contact; and 
 further comprising: 
 a second active portion next to another side of the insulation region, the second active portion having a spacing from the contact. 
 
     
     
       18. The system as claimed in  claim 16  wherein:
 the first active portion includes the first active portion adjacent the contact, the first active portion having a vertical side substantially parallel to a vertical side of the contact; and 
 further comprising: 
 a second active portion adjacent the contact, the second active portion having a vertical side substantially parallel to another vertical side of the contact. 
 
     
     
       19. The system as claimed in  claim 16  wherein the first active portion includes the first active portion adjacent the contact, the first active portion having a plane of a top side substantially aligned to a plane of a bottom side of the contact. 
     
     
       20. The system as claimed in  claim 16  further comprising an active portion adjacent the insulation region formed as a shallow trench isolation, the active portion having a side adjacent the sealring and another side adjacent another of the sealring.