Process for producing fluorocarbon microstructure, fluorocarbon microstructure, and microsystem

Abstract

A process for producing a fluorocarbon microstructure capable of easily fabricating a three-dimensional fluorocarbon microstructure. The process for producing a fluorocarbon microstructure comprises a first processing step for forming, on a substrate ( 2 ), a film deposition portion with a given pattern made up of a through-hole figure by etching the substrate ( 2 ), a fabricating step for forming a fluorocarbon film ( 6 ) on an inner circumferential surface of a film deposition portion ( 9 ) to fabricate a fluorocarbon region surrounded by the fluorocarbon film ( 6 ), and a second processing step for fabricating the fluorocarbon microstructure protruding from a processing surface of the substrate ( 2 ) by etching a given region other than a fluorocarbon region on the substrate ( 2 ). Hence, the three-dimensional fluorocarbon microstructure can be fabricated which comprises a complicated structure that has conventionally been hard to fabricate. Thus, a microchannel ( 1 ) equipped with the three-dimensional fluorocarbon microstructure can be easily fabricated.

The invention claimed is: 
     
       1. A process for producing a fluorocarbon microstructure comprising:
 a first processing step for forming, on a substrate, a film deposition portion with a given pattern made up of a depressed figure or a through-hole figure by etching said substrate, 
 a fabricating step for forming a fluorocarbon film on an inner surface of said film deposition portion to fabricate a fluorocarbon region surrounded by said fluorocarbon film, and 
 a second processing step for fabricating a fluorocarbon microstructure protruding from a processing surface of said substrate by etching a given region other than said fluorocarbon region on said substrate. 
 
     
     
       2. A process for producing a fluorocarbon microstructure according to  claim 1 , wherein a resist is patterned on said substrate to etch said substrate in said first processing step; the fluorocarbon film is formed on an inner surface of said film deposition portion and on said resist in said fabricating step; and a removing step is provided in which said resist and said fluorocarbon film on said resist are removed after said fabricating step. 
     
     
       3. A process for producing a fluorocarbon microstructure according to  claim 1 , wherein in said second processing step, a resist for said second processing step is patterned on said substrate and then a given region other than said fluorocarbon region on said substrate is etched. 
     
     
       4. A process for producing a fluorocarbon microstructure according to  claim 1 , wherein a silicon oxide film is already patterned on said substrate before said second processing step starts and then said substrate is etched with said silicon oxide film used as a mask in said second processing step. 
     
     
       5. A process for producing a fluorocarbon microstructure according to  claim 2 , wherein in said second processing step, a resist for said second processing step is patterned on said substrate and then a given region other than said fluorocarbon region on said substrate is etched.