Electronic modules and methods for forming the same

Abstract

Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

What is claimed is: 
     
       1. A method for electrically connecting a plurality of microelectronic dies, the method comprising:
 disposing the plurality of microelectronic dies on a single adhesive layer in a plurality of positions, each die thereafter having at least one exposed surface, the plurality of positions determined at least in part by a die placement mask located near the microelectronic dies; 
 placing the adhesive layer in contact with a substrate having a first side and a second side, the second side comprising a plurality of cavities, the cavities located at a plurality of positions corresponding to the positions of the microelectronic dies so as to receive the microelectronic dies; 
 applying an encapsulant over the exposed surfaces of the microelectronic dies so as to encapsulate each microelectronic die; 
 removing at least a portion of the adhesive layer from each microelectronic die; and thereafter forming at least one electrical connection between at least two of the microelectronic dies. 
 
     
     
       2. The method of  claim 1  further comprising curing the applied encapsulant over a period of time. 
     
     
       3. The method of  claim 1  further comprising:
 forming a plurality of fill holes in the first side of the substrate, each cavity being in fluidic communication with at least one fill hole; and 
 applying the encapsulant by injecting it through the fill holes. 
 
     
     
       4. The method of  claim 3  further comprising forming at least one post within at least one of the cavities. 
     
     
       5. The method of  claim 4 , wherein the post is formed during formation of the cavity. 
     
     
       6. The method of  claim 5 , wherein both the post and the cavity are formed by etching the substrate. 
     
     
       7. The method of  claim 4 , wherein the post and the substrate each comprise the same material. 
     
     
       8. The method of  claim 4 , wherein the post and the substrate each comprise a semiconductor material. 
     
     
       9. The method of  claim 8 , wherein the post and the substrate each comprise silicon. 
     
     
       10. The method of  claim 4  further comprising forming a conductive material over the post and an interior surface of the cavity. 
     
     
       11. The method of  claim 10 , wherein at least a portion of the electrical connection comprises the post. 
     
     
       12. The method of  claim 1 , wherein the adhesive layer comprises a dielectric material.