Magnetic field simulator for testing singulated or multi-site strip semiconductor device and method therefor

Abstract

A system for testing a magnetic sensor has a plurality of coils, wherein the coils are positioned along perpendicular planes. A magnetic field is generated along each of the perpendicular planes when a current is sent to each of the plurality of coils.

What is claimed is: 
     
       1. A system for testing magnetic sensors the system comprising:
 a plurality of test coils, comprising a test coil positioned within each semiconductor device of an array of semiconductor devices, a test coil positioned along each row of semiconductor devices in the array of semiconductor devices, and a test coil positioned along each column of semiconductor devices in the array of semiconductor devices, each semiconductor device of the array comprising a magnetic sensor, and wherein the test coils are positioned along perpendicular planes; 
 wherein a magnetic field is generated along each of the perpendicular planes for each semiconductor device of the array when a current is sent to each of the plurality of test coils. 
 
     
     
       2. The system of  claim 1 , further comprising a control unit coupled to the plurality of test coils for each semiconductor device of the array for sending the current to each of the plurality of test coils to generate the magnetic field along each of the perpendicular planes. 
     
     
       3. The system of  claim 1 , wherein the plurality of test coils are positioned along an X-axis, a Y-axis, and a Z-axis of each a semiconductor device of the array having the magnetic sensor. 
     
     
       4. The system of  claim 3 , wherein the test coil positioned along the Z-axis of each of the semiconductor devices of the array is positioned within the semiconductor device adjacent to the magnetic sensor. 
     
     
       5. The system of  claim 3 , wherein the test coils positioned along the X-axis and the Y-axis of each of the semiconductor devices of the array are positioned below the semiconductor device. 
     
     
       6. The system of  claim 3 , further comprising a substrate for positioning the test coils along the X-axis and the Y-axis of each of the semiconductor devices of the array. 
     
     
       7. The system of  claim 1 , wherein the plurality of test coils are positioned along an X-axis, a Y-axis, and a Z-axis of a plurality of semiconductor devices on a strip. 
     
     
       8. The system of  claim 7 , wherein at least one test coil is positioned in each semiconductor device along the Z-axis of each of the semiconductor devices of the array. 
     
     
       9. The system of  claim 7 , wherein the plurality of semiconductor devices are positioned in a matrix having a defined number of rows and columns, wherein the number of test coils along the X-axis is equal to the number of rows in the matrix. 
     
     
       10. The system of  claim 7 , wherein the plurality of semiconductor devices are positioned in a matrix having a defined number of rows and columns, wherein the number of test coils along the Y-axis is equal to the number of columns in the matrix. 
     
     
       11. A system for testing semiconductor devices the system comprising:
 a first test coil positioned along an X-axis of each row of semiconductor devices of an array of semiconductor devices, each semiconductor device of the array comprising a magnetic sensor; 
 a second test coil positioned along a Y-axis of each column of semiconductor devices of the array of semiconductor devices; and 
 a third test coil positioned along a Z-axis of within each semiconductor device of the array of semiconductor devices. 
 
     
     
       12. The system of  claim 11 , further comprising a control unit coupled to the first test coil, the second test coil, and the third test coil positioned along the axes of each semiconductor device of the array of semiconductor devices for sending a current to each test coil to generate magnetic fields. 
     
     
       13. The system of  claim 12 , wherein the control unit comprises a plurality of current sources. 
     
     
       14. The system of  claim 11 , wherein the third test coil positioned along the axes of each semiconductor device of the array of semiconductor devices is positioned within the semiconductor device adjacent to the magnetic sensor. 
     
     
       15. The system of  claim 11 , wherein the first coil and the second test coil positioned along the axes of each semiconductor device of the array of semiconductor devices are positioned below the semiconductor device. 
     
     
       16. The system of  claim 11 , wherein the first test coil and the second test coil positioned along the X and Y axes of each semiconductor device of the array of semiconductor devices are positioned on a substrate below the semiconductor device. 
     
     
       17. A method of testing semiconductor devices the method comprising:
 positioning a first test coil along an X-axis of each row of semiconductor devices of an array of semiconductor devices; 
 positioning a second test coil along a Y-axis of each column of semiconductor devices of the array of semiconductor devices; 
 positioning a third test coil along a Z-axis of within each semiconductor device of the array of semiconductor devices; 
 sending a current to each of the first test coil, the second test coil, and the third test coil of each semiconductor device of the array of semiconductor devices to generate a magnetic field along the X-axis, the Y-axis and the Z-axis of each of the array of semiconductor devices; and 
 measuring a response of the magnetic sensor of each semiconductor device of the array of semiconductor devices when the magnetic field along the X-axis, the Y-axis and the Z-axis of each semiconductor device of the array of semiconductor devices is generated. 
 
     
     
       18. The method of  claim 17 , further comprising programming the magnetic sensor. 
     
     
       19. The method of  claim 17 , wherein positioning a third test coil along a Z-axis of each semiconductor device of the array of semiconductor devices further comprises placing the third test coil within each of the semiconductor devices adjacent to the magnetic sensor. 
     
     
       20. The method of  claim 17 , further comprises positioning the first test coil and the second test coil positioned along the X and Y axes of each semiconductor device of the array of semiconductor devices on a substrate.