Low-K dielectric functional imprinting materials

Abstract

A polymerizable composition includes an organic modified silicate selected from the group consisting of silsesquioxanes having the composition RSiO 1.5 , partially condensed alkoxysilanes, organically modified silicates having the composition RSiO 3 and R 2 SiO 2 , and partially condensed orthosilicates having the composition SiOR 4 , where R is an organic substituent; a decomposable organic compound; a photoinitiator; and a release agent. The composition polymerizes upon exposure to UV radiation to form an inorganic silica network, and the decomposable organic compound decomposes upon exposure to heat to form pores in the inorganic silica network. The composition may be used to form a patterned dielectric layer in an integrated circuit device. A metallic film may be disposed on the patterned dielectric layer and then planarized.

What is claimed is: 
     
       1. A polymerizable composition comprising:
 a) an organic modified silicate selected from the group consisting of silsesquioxanes having the composition RSiO 1.5 , partially condensed alkoxysilanes, organically modified silicates having the composition RSiO 3  and R 2 SiO 2 , and partially condensed orthosilicates having the composition SiOR 4 , where each R is an organic substituent independently comprising (meth)acrylate, vinyl, or epoxide, and each partially condensed alkoxysilane comprises one or more pendant functional groups independently comprising (meth)acrylate, vinyl, or epoxide; 
 b) a decomposable organic compound; 
 c) a photoinitiator; and 
 d) a release agent, wherein the composition polymerizes upon exposure to UV radiation to form an inorganic silica network, and the decomposable organic compound decomposes upon exposure to heat to form pores in the inorganic silica network. 
 
     
     
       2. The composition of  claim 1 , wherein the organic modified silicate has a molecular weight of less than about 50,000 Dalton. 
     
     
       3. The composition of  claim 1 , wherein the organic modified silicate comprises at least 10 weight percent silicon. 
     
     
       4. The composition of  claim 1 , wherein the decomposable organic compound is chemically bonded to the UV curable organic modified silicate. 
     
     
       5. The composition of  claim 1 , wherein the decomposable organic compound comprises from about 10 to 50 weight percent of the composition. 
     
     
       6. The composition of  claim 1 , wherein the decomposable organic compound is a polycaprolactone. 
     
     
       7. The composition of  claim 1 , wherein the release agent is a fluorosurfactant. 
     
     
       8. The composition of  claim 1 , further comprising a solvent. 
     
     
       9. The composition of  claim 1 , wherein a viscosity of the composition at 25° C. is in a range from about 0.01 centipoise to about 100 centipoise. 
     
     
       10. The composition of  claim 1 , wherein the pores have a dimension of about 3 nm to about 30 nm. 
     
     
       11. The composition of  claim 1 , wherein a volume of the pores in the inorganic silica network is between about 10 vol % and about 40 vol %. 
     
     
       12. The composition of  claim 11 , wherein the volume of the pores in the inorganic silica network is between about 20 vol % and about 30 vol %. 
     
     
       13. The composition of  claim 1 , wherein the inorganic silica network is a bonded —Si—O— network.