Interposer and package on package structure

Abstract

A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure.

What is claimed is:   
     
       1. An interposer, comprising:
 an insulating base, the insulating base including a first surface and a second surface opposite to the first surface; a plurality of electric conductive pillars, the electric conductive pillars extending through in the insulating base, extension direction of the electric conductive pillars being perpendicular to the second surface, the height of the electric conductive pillar relative to the second surface being greater than the thickness of the insulating base; and a thermal conductive frame, the thermal conductive frame attached on one side of the insulating base, the thermal conductive frame being configured for receiving a component; wherein the thermal conductive frame includes a top plate and a plurality of thermal conductive pillars perpendicularly extending from the top plate, the top plate partially received in the insulating base, extension direction of the thermal conductive pillar being perpendicular to the second surface, a height of the thermal conductive pillar relative to the second surface being greater than the thickness of the insulating base. 
 
     
     
       2. The interposer of  claim 1 , wherein a height of the electric conductive pillars relative to the insulating base is equal to that of the thermal conductive pillars relative to the insulating base. 
     
     
       3. The interposer of  claim 1 , wherein the top plate includes a top surface facing away from the thermal conductive pillars, the top surface and the first surface being coplanar. 
     
     
       4. The interposer of  claim 1 , wherein the top plate includes a top surface facing away from the thermal conductive pillars, the top surface located within the insulating base. 
     
     
       5. The interposer of  claim 1 , wherein the electric conductive pillar includes a first end face and a second end face opposite to the first end face, the first end face and the first surface being located on a same plane, the second end face protruding from the second surface. 
     
     
       6. The interposer of  claim 5 , wherein the interposer includes a plurality of first contact pads, the first contact pads formed on the first surface, the first contact pads being aligned with and electrically connected with the electric conductive pillars. 
     
     
       7. The interposer of  claim 1 , wherein the interposer includes a thermal conductive connector, the thermal conductive connector interconnected between the thermal conductive frame and an electric conductive pillar. 
     
     
       8. An interposer, comprising:
 an insulating base, the insulating base including a first surface and a second surface opposite to the first surface; a plurality of conductive vias, the conductive vias arranged in the insulating base; a plurality of electric conductive pillars, the electric conductive pillars being aligned with the conductive vias respectively, extension direction of the electric conductive pillar being perpendicular to the second surface, the height of the electric conductive pillars relative to the second surface being greater than the thickness of the insulating base; a thermal conductive frame, the thermal conductive frame attached on one side of the insulating base, the thermal conductive frame being configured for receiving a component; wherein the thermal conductive frame includes a top plate and a plurality of thermal conductive pillars perpendicular extending from the top plate, the top plate includes a top surface facing away from the thermal conductive pillars, the top surface being in contact with the second surface, extension direction of the thermal conductive pillars being perpendicular to the second surface, the height of the thermal conductive pillar relative to the second surface being greater than the thickness of the insulating base; wherein the interposer includes a thermal conductive connector, the thermal conductive connector interconnected between the thermal conductive frame and one electric conductive pillar. 
 
     
     
       9. The interposer of  claim 8 , wherein the height of the electric conductive pillars relative to the insulating base is equal to that of the thermal pg, 23  conductive pillar relative to the insulating base. 
     
     
       10. The interposer of  claim 8 , wherein the interposer includes a solder mask layer and a plurality of first contact pads, the first contact pads formed on the first surface, the first contact pads being aligned with and electrically connected with the electric conductive pillars, the solder mask layer formed on the first surface, a plurality of openings defining in the solder mask layer, the openings being aligned with the first contact pads, the first contact pads exposed through the corresponding openings. 
     
     
       11. A package on package structure, comprising a first package substrate, a first chip, a second package substrate, a second chip, a first solder, a second solder and an interposer of  claim 1 ; the first package substrate formed on the second surface side of the interposer; the first package substrate including a plurality of first contact pads and a plurality of second contact pads; the first chip and the first package substrate being electrically interconnected through the first contact pads; one side of the electric conductive pillars being aligned with and electrically connected with the first contact pad through the first solder; the first chip arranged in the thermal conductive frame; the second package substrate formed on the first surface side of the interposer; the second package substrate including a plurality of third contact pads aligned with and electrically interconnected with electric conductive pillars; the other side of the electric conductive pillars being aligned with and electrically connected with the third contact pad through the second solder. 
     
     
       12. The interposer of  claim 11 , wherein the cross-section area of the first package substrate is greater than that of the interposer and the second package substrate, the interposer and, pg, 24  a packaging adhesive covers the second package substrate. 
     
     
       13. The interposer of  claim 11 , wherein the first package substrate includes a plurality of fourth contact pads, the fourth contact pads being opposite to the first contact pads, a solder ball formed on the fourth contact pad.