USD1086087SActiveUtility

CMP (chemical mechanical planarization) retaining ring

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Mar 30, 2023Filed: Jun 14, 2023Granted: Jul 29, 2025

Est. expiryMar 30, 2043(~16.7 yrs left)· nominal 20-yr term from priority

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Claims

exact text as granted — not AI-modified

CLAIM 
     
       The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.

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