Inventor · disambiguated record
Hyungjoo Lee
Also filed as: LEE HYUNGJOO
15 granted patents·8 pending applications·24 citations·filing 2019–2025
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD23
Top patents by PatentIndex Score
23 records- 0192US11264291B2Sensor device and etching apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 1, 2022·9 cites·18 claims
- 0289US11114744B2Antenna having single non-conductive portion and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 7, 2021·5 cites·8 claims
- 0384US11569561B2Antenna having single non-conductive portion and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·12 claims
- 0481US2025015482A1Antenna having single non-conductive portion and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0575US12100884B2Antenna having single non-conductive portion and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·16 claims
- 0674US2025392047A1Electronic device comprising antennaSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0773USD1063595SCMP (chemical mechanical planarization) retaining ringSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·5 cites·1 claims
- 0870USD1062662SCMP (chemical mechanical planarization) retaining ringSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 18, 2025·4 cites·1 claims
- 0966US2025364732A1Electronic device comprising antennaSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1064US2025170686A1Retainer ring for chemical mechanical polishing apparatus and chemical mechanical polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1164US2025269489A1Carrier head and substrate polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1258US12463353B2Electronic device including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 1358US2025345895A1Conditioner assembly and polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1455US12507361B2Foldable electronic device including flexible display with a curved regionSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 1554US12009577B2Electronic device including an antennaSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 1654US11715628B2Method of forming plasma processing apparatus, related apparatus, and method of forming semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·17 claims
- 1754US2024113415A1Electronic device including conductive portions of housing operating as antennaSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1851US11862440B2Semiconductor processing equipment including electrostatic chuck for plasma processingSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·18 claims
- 1951US2024079762A1Electronic device including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2050US12183996B2Electronic device including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 2129USD1086087SCMP (chemical mechanical planarization) retaining ringSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·1 claims
- 2224USD1103949SCMP (chemical mechanical planarization) retaining ringSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·1 claims
- 2324USD1103131SCMP (chemical mechanical planarization) retaining ringSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →