USD1103131SActiveUtility

CMP (chemical mechanical planarization) retaining ring

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Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Jul 17, 2023Filed: Sep 1, 2023Granted: Nov 25, 2025
Est. expiryJul 17, 2043(~17 yrs left)· nominal 20-yr term from priority
Inventors:Hyungjoo LeeHyeondong SongJoonsuk JeongKyumin Sim
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PatentIndex Score
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Cited by
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References
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Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.

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