USD323173SExpiredUtility

Instrument for transferring boats for thermal treatment of semiconductor wafers

Assignee: TEL SAGAMI LTDPriority: Jul 25, 1988Filed: Jan 25, 1989Granted: Jan 14, 1992
Est. expiryJul 25, 2008(expired)· nominal 20-yr term from priority
36
PatentIndex Score
2
Cited by
3
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for an instrument for transferring boats for thermal treatment of semiconductor wafers, as shown and described.

Join the waitlist — get patent alerts

Track USD323173S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.