USD405062SExpiredUtility

Processing tube for use in a semiconductor wafer heat processing apparatus

Assignee: TOKYO ELECTRON LTDPriority: Aug 20, 1997Filed: Feb 5, 1998Granted: Feb 2, 1999
Est. expiryAug 20, 2017(expired)· nominal 20-yr term from priority
87
PatentIndex Score
32
Cited by
10
References
1
Claims

Claims

exact text as granted — not AI-modified
I claim the ornamental design for processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

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