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Carrier element for a semiconductor chip for integration into a chipcard

71
Assignee: SIEMENS AGPriority: Oct 25, 1996Filed: Apr 25, 1997Granted: Feb 16, 1999
Est. expiryOct 25, 2016(expired)· nominal 20-yr term from priority
Inventors:Michael HuberPeter StampkaErik HeinemannChristian HauserFrank Pueschner
71
PatentIndex Score
17
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7
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1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a carrier element for a semiconductor chip for integration into a chipcard, as shown and described.

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