Inventor · disambiguated record
Peter Stampka
Also filed as: STAMPKA PETER
38 granted patents·9 pending applications·645 citations·filing 1997–2024
98Inventor score
Files withINFINEON TECHNOLOGIES AG33SIEMENS AG10CIRCLE SMART CARD AG1HOEGERL JUERGEN1INFINEON TECHNOLOGIES AUSTRIA AG1
Top patents by PatentIndex Score
47 records- 0189US7605453B2Chip module and chip cardINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 20, 2009·26 cites·36 claims
- 0287US6201296B1Semiconductor chip with protection against analyzingSIEMENS AG·Filed 1999·Granted Mar 13, 2001·91 cites·9 claims
- 0385USD406822SCarrier element for a semiconductor chip for integration into a chipcard, or a chipcard moduleSIEMENS AG·Filed 1997·Granted Mar 16, 1999·31 cites·1 claims
- 0482US10380477B2Chip card and method of forming a chip cardINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 13, 2019·4 cites·9 claims
- 0582US7240847B2Chip cardCIRCLE SMART CARD AG·Filed 2005·Granted Jul 10, 2007·22 cites·7 claims
- 0682US6288904B1Chip module, in particular for implantation in a smart card bodyINFINEON TECHNOLOGIES AG·Filed 1999·Granted Sep 11, 2001·67 cites·17 claims
- 0778US10585034B2Smart card module, method for producing a smart card module, smart card and method for testing a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 10, 2020·1 cites·21 claims
- 0878US6188580B1Smart card and semiconductor chip for use in a smart cardINFINEON TECHNOLOGIES AG·Filed 1999·Granted Feb 13, 2001·59 cites·16 claims
- 0977US6384425B1Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formedINFINEON TECHNOLOGIES AG·Filed 1998·Granted May 7, 2002·47 cites·5 claims
- 1076US10440825B2Chip card module and method for producing a chip card moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Oct 8, 2019·2 cites·13 claims
- 1172US10157848B2Chip card module arrangement, chip card arrangement and method for producing a chip card arrangementINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 18, 2018·2 cites·18 claims
- 1271USD405779SCarrier element for a semiconductor chip for integration into a chipcardSIEMENS AG·Filed 1997·Granted Feb 16, 1999·17 cites·1 claims
- 1370US6191951B1Smart card module and smart card including a smart card moduleINFINEON TECHNOLOGIES AG·Filed 1999·Granted Feb 20, 2001·39 cites·12 claims
- 1468US9912058B2Hybrid antenna, antenna arrangement and method for manufacturing an antenna arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 6, 2018·2 cites·23 claims
- 1568US9672459B2Chip card with integrated active componentsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·2 cites·18 claims
- 1668US9135549B2Smart card module, smart card and method for producing a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 15, 2015·2 cites·24 claims
- 1768US9070067B2Smart card module and method for producing a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 30, 2015·2 cites·21 claims
- 1867US7337967B2Chip card moduleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 4, 2008·4 cites·13 claims
- 1967US6025997AChip module for semiconductor chips having arbitrary footprintsSIEMENS AG·Filed 1998·Granted Feb 15, 2000·35 cites·17 claims
- 2066US9935042B2Semiconductor package, smart card and method for producing a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 3, 2018·1 cites·9 claims
- 2166US6313524B1Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrateINFINEON TECHNOLOGIES AG·Filed 1999·Granted Nov 6, 2001·34 cites·14 claims
- 2266US6185507B1Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unitSIEMENS AG·Filed 1999·Granted Feb 6, 2001·33 cites·7 claims
- 2365US7579679B2Chipcard with contact areas and method for producing contact areasINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 25, 2009·3 cites·7 claims
- 2461US10395157B2Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart cardINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 27, 2019·1 cites·20 claims
- 2561US6326683B1Carrier element for a semiconductor chipSIEMENS AG·Filed 1998·Granted Dec 4, 2001·32 cites·13 claims
- 2660US10423870B2Communication moduleINFINEON TECHNOLOGIES AG·Filed 2015·Granted Sep 24, 2019·1 cites·19 claims
- 2759US6088901AMethod for producing a carrier element for semiconductor chipsSIEMENS AG·Filed 1998·Granted Jul 18, 2000·24 cites·9 claims
- 2857US5874354AMethod for electrically connecting a semiconductor chip to at least one contact surface and smart card module and smart card produced by the methodSIEMENS AG·Filed 1998·Granted Feb 23, 1999·23 cites·2 claims
- 2955US2025045555A1Method for producing a smart card inlay, smart card inlay and smart cardINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3055US2009218667A1Smart cards and methods for producing a smart cardPUESCHNER FRANK·Filed 2009·Application pending·0 cites
- 3152US10114992B2Electronic identification documentINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 30, 2018·0 cites·19 claims
- 3251US11681888B2Sensor device, method of forming a sensor device, chip card and method of forming a chip cardINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 20, 2023·0 cites·15 claims
- 3350US5883429AChip coverSIEMENS AG·Filed 1997·Granted Mar 16, 1999·19 cites·16 claims
- 3449US7694888B2Method for producing a chip card contact zoneINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 13, 2010·0 cites·11 claims
- 3548US10229352B2Chip arrangement and method for checking whether a chip is arranged in an intended chip carrierINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 12, 2019·0 cites·14 claims
- 3647US2022366204A1Chip card biometric sensor componentINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3746US2023289554A1Smart card module, smart card module arrangement and smart cardINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3844US10223629B2Multicolored logo on smart card modulesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 5, 2019·0 cites·25 claims
- 3944US9141902B2Smart card module for a smart cardINFINEON TECHNOLOGIES AG·Filed 2012·Granted Sep 22, 2015·0 cites·11 claims
- 4043US2006043200A1Chip card moduleINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 4143US2014239428A1Chip arrangement and a method for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 4242US9177181B2Secure epass booklet based on double chip technologyHOEGERL JUERGEN·Filed 2012·Granted Nov 3, 2015·0 cites·15 claims
- 4342US2021303962A1Chip card and method for producing a chip cardINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 4440US6072698AChip module with heat insulation for incorporation into a chip cardSIEMENS AG·Filed 1998·Granted Jun 6, 2000·12 cites·4 claims
- 4539US6364205B1Chip card having a contact zone and method of producing such a chip cardINFINEON TECHNOLOGIES AG·Filed 1999·Granted Apr 2, 2002·7 cites·10 claims
- 4639US2014084070A1Chip card and method for manufacturing a chip cardINFINEON TECHNOLOGIES AG·Filed 2012·Application pending·0 cites
- 4737US2017154853A1Method for singulating a multiplicity of chipsINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →