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Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module

85
Assignee: SIEMENS AGPriority: Mar 6, 1997Filed: Sep 8, 1997Granted: Mar 16, 1999
Est. expiryMar 6, 2017(expired)· nominal 20-yr term from priority
Inventors:Michael HuberPeter Stampka
85
PatentIndex Score
31
Cited by
6
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module, as shown and described.

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