USD571739SExpiredUtility

Semiconductor wafer delivery apparatus

35
Assignee: TOKYO ELECTRON LTDPriority: Aug 12, 2005Filed: Nov 14, 2005Granted: Jun 24, 2008
Est. expiryAug 12, 2025(expired)· nominal 20-yr term from priority
Inventors:Hiroki Hosaka
35
PatentIndex Score
2
Cited by
15
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a semiconductor wafer delivery apparatus, as shown and described.

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