USD574792SActiveUtilityPatentIndex 84

Lower heat insulating cylinder for manufacturing semiconductor wafers

Assignee: TOKYO ELECTRON LTDPriority: Aug 23, 2006Filed: Feb 20, 2007Granted: Aug 12, 2008

Est. expiryAug 23, 2026(~0.1 yrs left)· nominal 20-yr term from priority

PatentIndex Score

Cited by

References

Claims

exact text as granted — not AI-modified

CLAIM 
     
       The ornamental design for a lower heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

No later patents cite this yet.

No backward citations on record.