USD574792SActiveUtility

Lower heat insulating cylinder for manufacturing semiconductor wafers

55
Assignee: TOKYO ELECTRON LTDPriority: Aug 23, 2006Filed: Feb 20, 2007Granted: Aug 12, 2008
Est. expiryAug 23, 2026(~0 yrs left)· nominal 20-yr term from priority
Inventors:Izumi Sato
55
PatentIndex Score
9
Cited by
9
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a lower heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

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