USD579885SActiveUtility

Upper heat insulating cylinder for manufacturing semiconductor wafers

67
Assignee: TOKYO ELECTRON LTDPriority: Feb 20, 2007Filed: Feb 20, 2007Granted: Nov 4, 2008
Est. expiryFeb 20, 2027(~0.6 yrs left)· nominal 20-yr term from priority
Inventors:Izumi Sato
67
PatentIndex Score
15
Cited by
8
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an upper heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

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