USD862404SActiveUtility

Sealing material ring for a semiconductor manufacturing apparatus

Assignee: KOKUSAI ELECTRIC CORPPriority: Oct 25, 2016Filed: Apr 19, 2017Granted: Oct 8, 2019
Est. expiryOct 25, 2036(~10.3 yrs left)· nominal 20-yr term from priority
90
PatentIndex Score
33
Cited by
20
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a sealing material ring for a semiconductor manufacturing apparatus, as shown and described.

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