USD929534SActiveUtility

Liquid discharge nozzle for semiconductor substrate processing apparatus

Assignee: TOKYO ELECTRON LTDPriority: Apr 25, 2019Filed: Oct 23, 2019Granted: Aug 31, 2021
Est. expiryApr 25, 2039(~12.8 yrs left)· nominal 20-yr term from priority
35
PatentIndex Score
1
Cited by
9
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described herein.

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