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Liquid discharge nozzle for semiconductor substrate processing apparatus

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Assignee: TOKYO ELECTRON LTDPriority: Jun 8, 2020Filed: Aug 3, 2020Granted: Sep 14, 2021
Est. expiryJun 8, 2040(~13.9 yrs left)· nominal 20-yr term from priority
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CLAIM 
     
       The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described.

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