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Temporary protective film for manufacturing semiconductor devices

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Assignee: SHOWA DENKO MATERIALS CO LTDPriority: Nov 2, 2020Filed: Apr 22, 2021Granted: Mar 22, 2022
Est. expiryNov 2, 2040(~14.3 yrs left)· nominal 20-yr term from priority
Inventors:Naoki Tomori
56
PatentIndex Score
2
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34
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1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.

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