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Temporary protective film for manufacturing semiconductor devices

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Assignee: SHOWA DENKO MATERIALS CO LTDPriority: Nov 14, 2019Filed: May 7, 2020Granted: Sep 6, 2022
Est. expiryNov 14, 2039(~13.3 yrs left)· nominal 20-yr term from priority
Inventors:Naoki Tomori
57
PatentIndex Score
2
Cited by
34
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.

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