Heat treatment apparatus

Abstract

A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective portions on the heat treatment table and temperatures detected by the sensors is grasped in advance, thereby enables to surmise a temperature of the respective portion of the heat treatment table from the temperature detected by the sensors. In the case of an wafer being actually treated by placing on the heat treatment table, the temperatures detected by the sensors are observed, from these detected temperatures, the temperatures of the respective portions on the heat treatment table, that is, temperatures affecting the wafer, are surmised.

1. A heat treatment apparatus, which comprises:
 a heat treatment table thereon a substrate to be treated is disposed, the heat treatment table being concentrically divided into a plurality of regions;  
 two or morea plurality of heaters heating each regions obtained by dividing the heat treatment table into two or moreconcentrically disposed in respective regions of the heat treatment table;  
 at least one sensora plurality of sensors for detecting a temperature of thea predetermined portion of the heat treatment table, the plurality of sensors comprising a first group of sensors disposed in a horizontal direction of the heat treatment table and a second group of sensors disposed in a vertical direction of the heat treatment table;  
 a  means for surmising thea temperature of each portionsregion of the heat treatment table based on the detected temperaturetemperatures detected by the first and second group of sensors; and  
 a  means for controlling output of the  each heatersheater based on the detectedsurmised temperature of each region so that the temperature of the entire heat treatment table is uniform;  
 wherein each of the heaters disposed on the heat treatment table are disposed concentric, and sensors are disposed in a thickness direction .  
 
     
     
       2. The heat treatment apparatus as set forth in  claim 1 , wherein:
 wherein  the surmising means for surmising the temperature iscomprises an arithmetic unit which is connected to the sensorsensors; and, based on the detected temperature, surmises mathematically the temperatures of the each portions of the heat treatment table; 
 wherein  the controlling means iscomprises a control unit which is connected to the arithmetic unitand, based on the surmised temperatures of the each portions, controls the output of the each heaters so that the temperature of the entire heat treatment table is uniform .  
 
     
     
       3. A heat treatment apparatus, which comprises:
 a heat treatment table thereon a substrate to be treated is disposed, the heat treatment table being concentrically divided into a plurality of regions;  
 two or morea plurality of heaters heating each regions obtained by dividing the heat treatment table into two or more regionsconcentrically disposed in respective regions of the heat treatment table;  
 at least one sensora plurality of sensors for detecting a temperature of thea predetermined portion of the heat treatment table, the plurality of sensors comprising a first group of sensors disposed in a horizontal direction of the heat treatment table and a second group of sensors disposed in a vertical direction of the heat treatment table;  
 a  means for surmising an amount of heat to be supplied to each portionsregion of the substrate to be treated based on the detected temperaturetemperatures detected by the first and second groups of sensors; and  
 a  means for controlling output of the  each heatersheater based on the surmised amount of heat so that the amount of heat supplied to the substrate to be treated is uniform;  
 wherein each of the heaters disposed on the heat treatment table are disposed concentric, and sensors are disposed in a thickness direction .  
 
     
     
       4. The heat treatment apparatus as set forth in  claim 3 , wherein:
 wherein  the surmising means for surmising the temperature iscomprises an arithmetic unit which is connected to the sensor and, based on the detected temperature, surmises mathematically the amount of heat supplied to the each portions of the substrate to be treatedsensors; and  
 wherein  the controlling means iscomprises a control unit which is connected to the arithmetic unitand, based on the surmised temperatures of the each portions, controls the output of the each heaters so that the amount of heat supplied to the substrate to be treated is uniform .  
 
     
     
       5. The heat treatment apparatus as set forth in  claim 1 , further comprises  comprising:
 a cover assembly which is disposed opposite to the heat treatment table above the heat treatment table and evacuates a gas heated by the heat treatment table, the cover assembly having a plurality of upper heaters disposed on a surface opposite to the heat treatment table, the upper heaters being divided into a plurality of concentric groups of heaters, each of concentric groups of heaters further comprising a plurality of independent heaters;  
 wherein, on the surface opposite to the heat treatment table of the cover assembly, a plurality of upper heaters are disposed divided concentric .  
 
     
     
       6. The heat treatment apparatus as set forth in  claim 3 , which  further comprises  comprising:
 a cover assembly which is disposed opposite to the heat treatment table above the heat treatment table and evacuates a gas heated by the heat treatment table, the cover assembly having a plurality of upper heaters disposed on a surface opposite to the heat treatment table, the upper heaters being divided into a plurality of concentric groups of heaters, each of concentric groups of heaters further comprising a plurality of independent heaters;  
 wherein, on the surface opposite to the heat treatment table of the cover assembly, a plurality of upper heaters are disposed divided concentric .  
 
     
     
       7. The heat treatment apparatus as set forth in  claim 1 , wherein:
 the controlling means comprises a memory element storing a reference table which specifies the temperature of each region of the heat treatment table through the detected temperatures of the predetermined portions; and 
 the surmising means surmises the temperature of each region of the heat treatment table based on the reference table stored in the memory element 
 wherein thus each heaters disposed to the heat treatment table are disposed concentric, and sensors are disposed in one line in a diameter direction of the heat treatment table. .  
 
     
     
       8. The heat treatment apparatus as set forth in claim  1    7 , wherein:
 the reference table stored in the memory element further specifies a power supply to the heaters based on the surmised temperatures; and  
   the controlling means controls the output of each heater based on the reference table stored in the memory element   
 wherein the each heaters disposed on the heat treatment table are disposed concentric, and sensors are disposed in one line in a diameter direction and in a thickness direction. .  
 
     
     
       9. The heat treatment apparatus as set forth in  claim 3 , wherein:
 the controlling means comprises a memory element storing a reference table which specifies the amount of heat supplied to each region of the substrate through the detected temperatures of the predetermined portions; and  
   the surmising means surmises the amount of heat supplied to each region of the substrate based on the reference table stored in the memory element   
 wherein the each heaters disposed to the heat treatment table are disposed concentric, and sensors are disposed in one line in a diameter direction. 
 
     
     
       10. The heat treatment apparatus as set forth in claim  3    9 , wherein:
 the reference table stored in the memory element further specifies a power supply to the heaters based on the surmised amount of heat; and  
   the controlling means controls the output of each heater based on the reference table stored in the memory element   
 wherein the each heaters disposed on the heat treatment table are disposed concentric, and sensors are disposed in one line in a diameter direction and in a thickness direction .  
 
     
     
       11. The heat treatment apparatus as set forth in  claim 1 , further comprising:
 a first heating means for heating a lower surface of a substrate to be treated to a predetermined temperature; and a second heating means for 
 an upper heater unit heating an upper surface of the substrate to be treated at a temperature higher than the first heating meansa temperature of the heaters.  
 
     
     
       12. The heat treatment apparatus as set forth in  claim 11 , which  further comprises  comprising:
 a  means for controlling the second heating meansupper heater unit to a temperature where the substrate to be treated is exposed to heat treatment at an aimed temperature.  
 
     
     
       13. A heat treatment apparatus as set forth in  claim 12 , which  further comprises  comprising:
 a  means for detecting thea temperature of the substrate to be treated;  
 wherein the controlling means is a means for controlling the second heating means,  the upper heater unit controlling means controls the upper heater unit based on the detected temperature of the substrate to be treated, so that a temperature of heat treatment of the substrate to be treated is an aimed temperature.  
 
     
     
       14. The heat treatment apparatus as set forth in  claim 12 , further comprising a cover assembly which is disposed opposite to the heat treatment table above the heat treatment table and evacuates a gas heated by the heat treatment table, wherein:
 wherein the first heating means is a heating plate thereon a substrate to be treated is disposed, and which comprises further a cover assembly which is disposed opposite to the heating plate above the heating plate and evacuates a gas heated by the heating plate; 
 the second heating means is  upper heater unit comprises at least one heater disposed on a surface of the cover assembly opposed to the heating plate  heat treatment table; and  
 the controlling means comprises a first control unit for maintaining the heating plate at a predetermined temperature, and a second control unit  the upper heater unit controlling means for adjusting the heater to a temperature which is higher than the heating plate  a temperature of the heat treatment table and under which the substrate to be treated is treated at an aimed temperature.  
 
     
     
       15. The heat treatment apparatus as set forth in  claim 12 , further comprising:
 a cover assembly which is disposed opposite to the heat treatment table above the heat treatment table and evacuates a gas heated by the heat treatment table; and  
   means for detecting a temperature of the substrate to be treated, wherein:   
 wherein the first heating means is a heating plate thereon a substrate to be treated is disposed, and which comprises further a cover assembly which is disposed opposite to the heating plate above the heating plate and evacuates a gas heated by the heating plate, and a sensor for detecting the temperature of the substrate to be treated; 
 the second heating means is  upper heater unit comprises at least one heater disposed on a surface of the cover assembly opposed to the heating plate  heat treatment table; and  
 the controlling means comprises a first control unit for maintaining the heating plate at a predetermined temperature, and a second control unit  the upper heater unit controlling means for adjusting the heater, based on the detected temperature of the substrate to be treated, to a temperature which is higher than the heating plate  a temperature of the heat treatment table and under which the substrate to be treated is treated at an aimed temperature.  
 
     
     
       16. The heat treatment apparatus as set forth in  claim 14 :
 wherein the  at least one heater of the second heating means  upper heater unit is divided into a plurality of heaters capable of turning on and off an electric power source independently.  
 
     
     
       17. The heat treatment apparatus as set forth in  claim 14 :
 wherein the  at least one heater of the second heating means  upper heater unit is disposed concentric.  
 
     
     
       18. The heat treatment apparatus as set forth in  claim 17 :
 wherein the  at least one heater of the second heating means  upper heater unit is divided into two or more parts along a diameter direction.  
 
     
     
       19. The heat treatment apparatus as set forth in  claim 14 :
 wherein the  at least one heater of the second heating means  upper heater unit is a gradation heater of which heating capacity is continuously inclined from the center of the cover assembly to the periphery portion.  
 
     
     
       20. The heat treatment apparatus as set forth in  claim 14 :
 wherein the the heating plate is a thermal surface plate which maintains  heat treatment table is maintained at a predetermined temperature by heating medium vapor circulating inside thereof.  
 
     
     
       21. The heat treatment apparatus as set forth in  claim 14 :
 wherein, on a lower surface side of the cover assembly, a flat surface opposite to the heating plate  heat treatment table is formed.  
 
     
     
       22. The heat treatment apparatus as set forth in claim  8    7 , wherein:
 wherein  the surmising means for surmising the temperature iscomprises an arithmetic unit which is connected to the sensors; and sensor and, based on the detected temperature, surmises mathematically the temperatures of the each portions of the heat treatment table; 
 wherein  the controlling means iscomprises a control unit which is connected to the arithmetic unit and, based on the surmised temperatures of the each portions, controls the output of the each heaters so that the temperature of the entire heat treatment table is uniform .  
 
     
     
       23. The heat treatment apparatus as set forth in  claim 8 , wherein:
 the surmising means comprises an arithmetic unit which is connected to the sensors; and  
   the controlling means comprises a control unit which is connected to the arithmetic unit   
 wherein each of the heaters disposed to the heat treatment table are disposed concentric, and sensors are disposed in one line in a diameter direction of the heat treatment table .  
 
     
     
       24. The heat treatment apparatus as set forth in claim  10    9 , wherein:
 wherein  the surmising means for surmising the temperature iscomprises an arithmetic unit which is connected to the sensor and, based on the detected temperature, surmises mathematically the amount of heat supplied to the each portions of the substrate to be treatedsensors; and  
 wherein  the controlling means iscomprises a control unit which is connected to the arithmetic unit and, and based on the surmised temperatures of the each portions, controls the output of the each heaters so that the amount of heat supplied to the substrate to be treated is uniform .  
 
     
     
       25. The heat treatment apparatus as set forth in  claim 10 , wherein:
 the surmising means comprises an arithmetic unit which is connected to the sensors; and  
   the control means comprises a control unit which is connected to the arithmetic unit   
 wherein each of the heaters disposed to the heat treatment table are disposed concentric, and sensors are disposed in one line in a diameter direction .  
 
     
     
       26. The heat treatment apparatus as set forth in  claim 3 , further comprising:
 a first heating means for heating a lower surface of a substrate to be treated to a predetermined temperature; and 
 a second heating means foran upper heater unit heating an upper surface of the substrate to be treated at a temperature higher than the first heating meansa temperature of the heaters.  
 
     
     
       27. The heat treatment apparatus as set forth in  claim 26 , which  further comprises  comprising:
 a  means for controlling the second heating meansupper heater unit to a temperature where the substrate to be treated is exposed to heat treatment at an aimed temperature.  
 
     
     
       28. The heat treatment apparatus as set forth in  claim 27 , which  further comprises  comprising:
 a  means for detecting thea temperature of the substrate to be treated;  
 wherein the controlling means is a means for controlling the second heating means,  the upper heater unit controlling means controls the upper heater unit based on the detected temperature of the substrate to be treated, so that a temperature of heat treatment of the substrate to be treated is an aimed temperature.  
 
     
     
       29. The heat treatment apparatus as set forth in  claim 27 , further comprising a cover assembly which is disposed opposite to the heat treatment table above the heat treatment table and evacuates a gas heated by the heat treatment table, wherein:
 wherein the first heating means is a heating plate thereon a substrate to be treated is disposed, and which comprises further a cover assembly which is disposed opposite to the heating plate above the heating plate and evacuates a gas heated by the heating plate; 
 the second heating means is  upper heater unit comprises at least one heater disposed on a surface of the cover assembly opposed to heating plate  heat treatment table; and  
 the controlling means comprises a first control unit for maintaining the heating plate at a predetermined temperature, and a second control unit  the upper heater unit controlling means for adjusting the heater to a temperature which is higher than the heating plate  a temperature of the heat treatment table and under which the substrate to be treated is treated at an aimed temperature.  
 
     
     
       30. The heat treatment apparatus as set forth in  claim 27 , further comprising:
 a cover assembly which is disposed opposite to the heat treatment table above the heat treatment table and evacuates a gas heated by the heat treatment table; and  
   means for detecting a temperature of the substrate to be treated, wherein:   
 wherein the first heating means is a heating plate thereon a substrate to be treated is disposed, and which comprises further a cover assembly which is disposed opposite to the heating plate above the heating plate and evacuates a gas heated by the heating plate, and a sensor for detecting the temperature of the substrate to be treated; 
 the second heating means is  upper heater unit comprises at least one heater disposed on a surface of the cover assembly opposed to the heating plate  heat treatment table; and  
 the controlling means comprises a first control unit for maintaining the heating plate at a predetermined temperature, and a second control unit  the upper heater unit controlling means for adjusting the heater, based on the detected temperature of the substrate to be treated, to a temperature which is higher than the heating plate  a temperature of the heat treatment table and under which the substrate to he  be treated is treated at an aimed temperature.  
 
     
     
       31. The heat treatment apparatus as set forth in  claim 29 :
 wherein the  at least one heater of the second heating means  upper heater unit is divided into a plurality of heaters capable of turning on and off an electric power source independently.  
 
     
     
       32. The heat treatment apparatus as set forth in  claim 29 :
 wherein the  at least one heater of the second heating means  upper heater unit is disposed concentric.  
 
     
     
       33. The heat treatment apparatus as set forth in  claim 32 :
 wherein the  at least one heater of the second heating means  upper heater unit is divided into two or more parts along a diameter direction.  
 
     
     
       34. The heat treatment apparatus as set forth in  claim 29 :
 wherein the  at least one heater of the second heating means  upper heater unit is a gradation heater of which heating capacity is continuously inclined from the center of the cover assembly to the periphery portion.  
 
     
     
       35. The heat treatment apparatus as set forth in  claim 29 :
 wherein the heating plate is a thermal surface plate which maintains  heat treatment table is maintained at a predetermined temperature by heating medium vapor circulating inside thereof.  
 
     
     
       36. The heat treatment apparatus as set forth in  claim 29 :
 wherein, on a lower surface side of the cover assembly, a flat surface opposite to the heating plate  heat treatment table is formed.