Chip light emitting diode and fabrication method thereof

Abstract

A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.

1. A chip light emitting diode comprising:
 a metal pad and a lead spaced away from each other on a printed circuit board;  
 a light emitting chip mounted on the metal pad;  
 a wire connecting the light emitting chip and the lead; and  
 a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross section elongated along the printed circuit board,  
 wherein the cross section of the curved projecting part is comprised of a plurality of straight lines with an angle formed between adjacent lines.  
 
     
     
       2. A chip light emitting diode as recited in  claim 1 , wherein the cross section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic. 
     
     
       3. A chip light emitting diode as recited in  claim 1 , wherein at least one stepped part is formed at an outer edge of the resin package. 
     
     
       4. A chip light emitting diode as recited in  claim 1 , wherein the surface of the resin package has fine striations to scattering light emitted from the light emitting chip. 
     
     
       5. A chip light emitting diode as recited in  claim 1 , wherein the resin package has one projecting part. 
     
     
       6. A chip light emitting diode as recited in  claim 1 , wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval,
 wherein the predetermined interval ranges from 0.1 to 0.4 times a bottom length of the resin package.  
 
     
     
       7. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead; and        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board and wherein at least one stepped part is formed at an outer edge of the resin package.     
     
     
       8. A chip light emitting diode as recited in  claim 7 , wherein the cross- section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic.   
     
     
       9. A chip light emitting diode as recited in  claim 7 , wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip. 
     
     
       10. A chip light emitting diode as recited in  claim 7 , wherein the resin package has one projecting part. 
     
     
       11. A chip light emitting diode as recited in  claim 7 , wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval;
   wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package.     
     
     
       12. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead; and        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board and wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip.     
     
     
       13. A chip emitting diode as recited in  claim 12 , wherein the cross- section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic.   
     
     
       14. A chip emitting diode as recited in  claim 12 , wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval;
   wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package.     
     
     
       15. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting, chip and the lead; and        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board;        wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval; and        wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package.     
     
     
       16. A chip emitting diode as recited in  claim 15 , wherein the cross- section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic.   
     
     
       17. A chip light emitting diode as recited in  claim 15 , wherein the resin package has one projecting part. 
     
     
       18. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead; and        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board and wherein one stepped part is formed at an outer edge of the resin package.     
     
     
       19. A chip light emitting diode as recited in  claim 18 , wherein the cross- section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic.   
     
     
       20. A chip light emitting diode as recited in  claim 18 , wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip. 
     
     
       21. A chip light emitting diode as recited in  claim 18 , wherein the resin package has one projecting part. 
     
     
       22. A chip light emitting diode as recited in  claim 18 , wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval;
   wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package.     
     
     
       23. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead;        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board and wherein the cross - section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic and at least one stepped part being formed at an outer edge of the resin package.     
     
     
       24. A chip light emitting diode as recited in  claim 23 , wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip. 
     
     
       25. A chip light emitting diode as recited in  claim 23 , wherein the resin package has one projecting part. 
     
     
       26. A chip light emitting diode as recited in  claim 23 , wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval;
   wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package.     
     
     
       27. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead; and        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board wherein at least one stepped part is formed at an outer edge of the resin package and wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip.     
     
     
       28. A chip light emitting diode as recited in  claim 27 , wherein the cross- section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic.   
     
     
       29. A chip light emitting diode as recited in  claim 27 , wherein the resin package has one projecting part. 
     
     
       30. A chip light emitting diode as recited in  claim 27 , wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval;
   wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package.     
     
     
       31. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead;        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at lest one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board, wherein at least one stepped part is formed at an outer edge of the resin package and wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval.     
     
     
       32. A chip light emitting diode as recited in  claim 31 , wherein the cross- section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic.   
     
     
       33. A chip light emitting diode as recited in  claim 31 , wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip. 
     
     
       34. A chip light emitting diode as recited in  claim 31 , wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package. 
     
     
       35. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead; and        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board, wherein the cross - section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic, and wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip.     
     
     
       36. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead; and        a resin package sealing the light emitting chip and at least a part of the metal pad, led, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board, wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip and wherein the resin package has one projecting part.     
     
     
       37. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead;        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board, wherein the surface of the resin package has fine striations to scatter light emitted from the light emitting chip and wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval.     
     
     
       38. A chip light emitting diode as recited in  claim 37 , wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package. 
     
     
       39. A chip light emitting diode comprising:
   a metal pad and a lead spaced away from each other on a printed circuit board;        a light emitting chip mounted on the metal pad;        a wire connecting the light emitting chip and the lead;        a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part, the at least one curved projecting part, the at least one curved projecting part having a cross - section elongated along the printed circuit board wherein the cross - section of the curved projecting part is substantially semicircular, or substantially or partially elliptical or parabolic and wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval.     
     
     
       40. A light emitting diode as recited in  claim 39  wherein the predetermined interval ranges from  0 . 1  to  0 . 4  times a bottom length of the resin package.