Mechanism for fixing probe card

Abstract

In a mechanism for fixing a probe card, the probe card and a support frame are joined to each other about the axis of each of the probe card and the support frame by a plurality of first fastening members. Also, the outer circumferential edge portion of the support frame is fixed by a plurality of second fastening members to a holder fixed to a probe unit. The probe card is held by the mechanism such that the central region of the probe card is restricted by the first fastening members and the outer circumferential portion of the probe card is not restricted so as to be rendered free. It follows that the probe card is expanded toward the outer circumferential edge portion by thermal expansion under a high-temperature. However, the probe card is prevented from being deformed in the shape of a dome.

1. A fixing mechanism arranged within a probe unit for examining the electrical characteristics of a target object, the target object being maintained under a high-temperature environment within a probe chamber, comprising:
 a probe card provided with a plurality of probes which are to be brought into an electrical and mechanical contact with the target object, which is configured to examine the electrical characteristics of the target object, the probe card being exposed to a high-temperature atmosphere;    a support frame configured to support the probe card in the central portion thereof;    a plurality of first fastening members configured to fasten the probe card on the support frame to fix the probe card;    a holding frame configured to hold the probe card and the support frame in the outer peripheral portions thereof so as to permit the probe card to be thermally expanded toward the periphery thereof, the holding frame being fixed to the probe unit; and    a plurality of second fastening members configured to fasten the holding frame on the support frame to fix the holding frame.    
     
     
       2. A fixing mechanism according to  claim 1 , wherein the probe card is held between the holding frame and the support frame. 
     
     
       3. A fixing mechanism according to  claim 1 , wherein the outer circumferential edge portion of the probe card is positioned between the support frame and the holding frame, and a clearance is formed on the outside of the outer circumferential surface of the probe card. 
     
     
       4. A fixing mechanism according to  claim 1 , wherein each of the support frame and the holding frame is formed of a material having a low thermal expansion coefficient. 
     
     
       5. A fixing mechanism according to  claim 1 , wherein a heat-insulating material layer is formed on the lower surface of at least one of the support frame and the holding frame. 
     
     
       6. A fixing mechanism according to  claim 1 , further comprising a head plate having the holding frame fixed thereto. 
     
     
       7. A fixing mechanism according to  claim 1 , wherein the holding frame corresponds to the head plate. 
     
     
       8. A fixing mechanism, comprising:
   a probe card provided with a plurality of probes, the plurality of probes being configured to make electrical and mechanical contact with a target object in a high temperature environment in a probe unit, when the fixing mechanism is installed in the probe unit;        a support frame for supporting the probe card; and        a plurality of first fastening members that fasten the probe card to the support frame;        wherein the probe card is fastened to the support frame in a configuration that permits the probe card to thermally expand toward a periphery of the probe card.     
     
     
       9. The fixing mechanism of  claim 8 , wherein the probe card comprises a circuit substrate and a contactor section, the plurality of probes being provided on the contactor section. 
     
     
       10. The fixing mechanism of  claim 9 , wherein the contactor section is fixed to a central portion of the circuit substrate. 
     
     
       11. The fixing mechanism of  claim 9 , wherein the support frame, the circuit substrate, and the contactor section are held together by the plurality of first fastening members. 
     
     
       12. The fixing mechanism of  claim 9 , wherein:
   the support frame comprises an outer circumferential rim having a thickness corresponding substantially to a thickness of the circuit substrate; and        the outer circumferential rim extends away from a surface of the support frame that contacts the circuit substrate.     
     
     
       13. The fixing mechanism of  claim 12 , wherein an inner diameter of the outer circumferential rim exceeds an outer diameter of the circuit substrate. 
     
     
       14. The fixing mechanism of  claim 8 , wherein the support frame is formed of a material having a low thermal expansion coefficient. 
     
     
       15. The fixing mechanism of  claim 8 , wherein a heat- insulating material layer is formed on a lower surface of the support frame.