Liquid feed nozzle, wet treatment apparatus and wet treatment method

Abstract

The wet treatment liquid feed nozzle of the invention comprises an introducing path having an introducing port, a discharging path having a discharging port, a crossing section formed by causing the introducing path and the discharging path to cross at the other ends thereof, a nozzle assembly having an opening section opening to an object to be treated, provided at the crossing section, and pressure control means, for controlling the difference between the pressure of the wet treatment liquid in contact with the object to be treated and the atmospheric pressure provided at least on the discharging path side so that the wet treatment liquid having been in contact with the object to be treated via the opening section does not flow to outside the discharging path.

1. A wet treatment method comprising the steps of:
 gradually feeding a wet treatment liquid from an introducing port of a wet treatment liquid feed nozzle to a region opposing an object to be wet-treated, the wet treatment liquid feed nozzle opposing the object to be wet-treated and having the introducing port and a discharging port which are open toward the object to be wet-treated, while cause a relative displacement of the object to be wet-treated and the wet treatment liquid feed nozzle, and 
 gradually discharging the wet treatment liquid fed from said wet treatment liquid feed nozzle to the object to be wet-treated through the discharging port without causing the wet treatment liquid to be in contact with portions other than the portion to which the wet treatment liquid has been fed, by controlling a difference between the pressure of the wet treatment liquid in contact with the object to be wet-treated and the atmospheric pressure so as to prevent the wet treatment liquid from flowing out from the region opposing the object to be wet-treated; 
 wherein the introducing port and the discharging port are constantly filled with the treatment liquid during treatment of the object to be wet-treated such that the treatment liquid flows continuously and smoothly through the region opposing the object to be wet-treated during a period the object to be wet-treated is partially under an opening section of the wet treatment liquid feed nozzle. 
 
     
     
       2. The wet treatment method of  claim 1  wherein the wet treatment fluid is discharged from a discharging port of the wet treatment liquid feed nozzle, and the step of controlling a difference between the pressure of the treatment liquid in contact with the object to be wet treated and the atmospheric pressure includes:
 fluidly coupling a liquid discharge unit with the discharging port; and 
 vertically displacing the liquid discharge unit. 
 
     
     
       3. The wet treatment method of  claim 1  wherein the wet treatment fluid is gradually fed into an introducing port of the wet treatment nozzle using a feed pump fluidly coupled with the introducing port, and the wet treatment fluid is discharged from a discharging port of the wet treatment liquid feed nozzle using a reduced-pressure pump, wherein the step of controlling a difference between the pressure of the wet treatment liquid in contact with the object to be wet-treated and the atmospheric pressure includes:
 detecting the pressure of the wet treatment liquid in contact with at least the object to be wet treated; and 
 controlling the reduced-pressure pump and the feed pump responsive to the detecting. 
 
     
     
       4. The wet treatment method of  claim 1  further comprising the step of imparting an ultrasonic wave to the wet treatment liquid. 
     
     
       5. The wet treatment method of  claim 1  further comprising the step of A wet treatment method comprising the steps of:
 gradually feeding a wet treatment liquid from an introducing port of a wet treatment liquid feed nozzle to a region opposing an object to be wet-treated, the wet treatment liquid feed nozzle opposing the object to be wet-treated and having the introducing port and a discharging port which are open toward the object to be wet-treated, while causing a relative displacement of the object to be wet-treated and the wet treatment liquid feed nozzle, 
 gradually discharging the wet treatment liquid fed from said wet treatment liquid feed nozzle to the object to be wet-treated through the discharging port without causing the wet treatment liquid to be in contact with portions other than the portion to which the wet treatment liquid has been fed, by controlling a difference between the pressure of the wet treatment liquid in contact with the object to be wet-treated and the atmospheric pressure so that the pressure including surface tension of the wet treatment liquid is substantially equal to the atmospheric pressure as to prevent the wet treatment liquid from flowing out from the region opposing the object to be wet-treated; and  
 ejecting a contact preventing gas at least between the wet treatment liquid feed nozzle and the object to be wet-treated to prevent the wet treatment liquid feed nozzle from contacting the object to be wet treated; 
 wherein the introducing port and the discharging port are constantly filled with the treatment liquid during treatment of the object to be wet-treated such that the treatment liquid flows continuously and smoothly through the region opposing the object to be wet-treated. 
 
     
     
       6. The wet treatment method of  claim 5  wherein the step of ejecting the contact preventing gas includes ejecting an inert gas between the wet treatment liquid feed nozzle and the object to be wet-treated. 
     
     
       7. The wet treatment of  claim 1  further comprising A wet treatment method comprising the steps of:
 gradually feeding a wet treatment liquid from an introducing port of a wet treatment liquid feed nozzle to a region opposing an object to be wet-treated, the wet treatment liquid feed nozzle opposing the object to be wet-treated and having the introducing port and a discharging port which are open toward the object to be wet-treated, while causing a relative displacement of the object to be wet-treated and the wet treatment liquid feed nozzle, 
 gradually discharging the wet treatment liquid fed from said wet treatment liquid feed nozzle to the object to be wet-treated through the discharging port without causing the wet treatment liquid to be in contact with portions other than the portion to which the wet treatment liquid has been fed, by controlling a difference between the pressure of the wet treatment liquid in contact with the object to be wet-treated and the atmospheric pressure so that the pressure including surface tension of the wet treatment liquid is substantially equal to the atmospheric pressure as to prevent the wet treatment liquid from flowing out from the region opposing the object to be wet-treated; and 
 irradiating light on the wet treatment liquid fed from the wet treatment liquid feed nozzle; 
 wherein the introducing port and the discharging port are constantly filled with the treatment liquid during treatment of the object to be wet-treated such that the treatment liquid flows continuously and smoothly through the region opposing the object to be wet-treated. 
 
     
     
       8. The wet treatment method of  claim 1  wherein the treatment liquid feed nozzle comprises:
 a nozzle assembly which has at least one introducing path having an introducing port for introducing a wet treatment liquid at an end thereof, at least one discharging path having a discharging port for discharging the wet treatment liquid after a wet treatment to outside the wet treatment system, a box-shaped crossing section formed by causing said at least one introducing path and said at least one discharging path to cross at the other ends thereof, the introducing path extending upward from one of the sides of the box-shaped crossing section in the longitudinal direction thereof and the discharging path extending upward from the side of the box-shaped crossing section in the longitudinal direction thereof, and an opening section opening to an object to be wet-treated provided at the bottom side of the crossing section, and pressure control means for controlling a difference between pressure of the wet treatment liquid in contact with the object to be wet-treated and the atmospheric pressure so as to prevent the wet treatment liquid in contact with the object to be wet-treated via said opening section from flowing outside said discharging path. 
 
     
     
       9. A method of manufacturing a liquid crystal display comprising subjecting a glass substrate to a wet treatment, which comprises:
 feeding a liquid for the wet treatment from an introducing port of a feed nozzle to a region of the feed nozzle opposing a surface of the glass substrate such that the liquid contacts the surface;   discharging the liquid from the surface through a discharging port, wherein the introducing port and the discharging port are constantly filled with the treatment liquid during treatment of the object to be wet-treated such that the treatment liquid flows continuously and smoothly through the region of the feed nozzle during a period the object to be wet-treated is partially under an opening section of the wet treatment liquid feed nozzle;   controlling a difference between a pressure of the liquid and an environmental pressure so that the pressure including surface tension of the liquid is substantially equal to the environmental pressure to prevent the liquid from flowing out from the surface; and   changing a relative displacement of the glass substrate to the feed nozzle.   
     
     
       10. The method of claim 9 wherein the wet treatment includes a washing treatment. 
     
     
       11. The method of claim 9 wherein the wet treatment includes an etching treatment. 
     
     
       12. The method of claim 9 wherein the liquid comprises one or more of extra pure water, a cleaning solution, or an etching solution. 
     
     
       13. The method of claim 9 wherein the environmental pressure is atmospheric pressure. 
     
     
       14. A method of manufacturing a semiconductor device comprising subjecting a substrate to a wet treatment, which comprises:
 feeding a liquid for the wet treatment from an introducing port of a feed nozzle to a region of the feed nozzle opposing a surface of the substrate such that the liquid contacts the surface;   discharging the liquid from the surface through a discharging port, wherein the introducing port and the discharging port are constantly filled with the treatment liquid during treatment of the object to be wet-treated such that the treatment liquid flows continuously and smoothly through the region of the feed nozzle during a period the object to be wet-treated is partially under an opening section of the wet treatment liquid feed nozzle;   controlling a difference between a pressure of the liquid and an environmental pressure so that the pressure including surface tension of the liquid is substantially equal to the environmental pressure to prevent the liquid from flowing out from the surface; and   changing a relative displacement of the substrate to the feed nozzle.   
     
     
       15. The method of claim 14 wherein the wet treatment includes a washing treatment. 
     
     
       16. The method of claim 14 wherein the wet treatment includes an etching treatment. 
     
     
       17. The method of claim 14 wherein the liquid comprises one or more of ultra pure water, a cleaning solution, or an etching solution. 
     
     
       18. The method of claim 14 wherein the environmental pressure is atmospheric pressure. 
     
     
       19. The method of claim 14 wherein the semiconductor device comprises a solar cell. 
     
     
       20. The method of claim 14 wherein the semiconductor device comprises a liquid crystal display.