P
USRE47271EActiveUtilityPatentIndex 51

Imprint recipe creating device and imprint device

Assignee: TOSHIBA MEMORY CORPPriority: Aug 31, 2010Filed: Jun 3, 2016Granted: Mar 5, 2019
Est. expiryAug 31, 2030(~4.2 yrs left)· nominal 20-yr term from priority
Inventors:MIKAMI SHINJIINANAMI RYOICHI
H10P 72/0448G03F 7/0002B82Y 10/00B82Y 40/00H01L 21/6715
51
PatentIndex Score
0
Cited by
18
References
25
Claims

Abstract

Certain embodiments provide an imprint recipe creating device comprising first to fifth creation units. The first creation unit creates inside-standard-shot information by use of filling amount information and residual film thickness information. The second creation unit creates first inside-substrate-surface information by use of shot position information, edge information, and the inside-standard-shot information. The third creation unit creates first correction information by use of unevenness information indicating unevenness in a substrate and unevenness distribution information indicating variations in depth of the unevenness inside the substrate surface. The fourth creation unit creates second correction information by use of post-process information indicating the variations in processing size. The fifth creation unit synthesizes the first inside-substrate-surface information, the first correction information and the second correction information, to create second inside-substrate-surface information.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. An imprint recipe creating device, comprising:
 a memory that stores a set of instructions; and 
 a hardware processor configured to execute the set of instructions, the set of instructions comprising:  
 a first creation unit which creates inside-standard-shot information indicating droplet positions of an imprint material in a shot area corresponding to one shot of imprinting by use of filling amount information indicating an amount of the imprint material that fills depressed portions of a template and a residual film thickness information indicating a film thickness of a residual film that is formed on a substrate to be processed; 
 a second creation unit which creates first inside-substrate-surface information indicating droplet positions of the imprint material inside a substrate surface by use of shot position information indicating a position at which a shot of imprinting is performed inside the substrate surface, edge information indicating an edge of the substrate, and the inside-standard-shot information; 
 a third creation unit which creates first correction information indicating droplet positions of the imprint material for correcting unevenness generated inside the substrate surface, by use of unevenness information indicating the unevenness in a substrate of the shot area, and unevenness distribution information indicating variations in depth of the unevenness inside the substrate surface; 
 a fourth creation unit which creates second correction information indicating droplet positions of the imprint material for correcting variations in processing size in processing after the imprint process inside the substrate surface by use of post-process information indicating the variations in processing size; 
 a fifth creation unit which synthesizes the first inside-substrate-surface information, the first correction information and the second correction information, to create second inside-substrate-surface information, and 
 a sixth creation unit which obtains a range of each shot area inside the substrate surface based on shot size information indicating a size of one shot of the imprinting and the shot position information, and carves the second inside-substrate-surface information by use of the range of each shot area, to create an imprint recipe corresponding to each shot area. 
 
     
     
       2. The imprint recipe creating device according to  claim 1 , wherein the second creation unit extracts a shot area as a partial shot from the shot position information and the edge information, and corrects the inside-standard-shot information with regard to the shot area as the partial shot such that the imprint material is not dropped to the outside of the edge of the substrate, to create the first inside-substrate-surface information. 
     
     
       3. The imprint recipe creating device according to  claim 1 , wherein the third creation unit creates the first correction information in which the droplet positions of the imprint material are set in positions corresponding to depressed portions inside the substrate surface. 
     
     
       4. An imprint device, which
 receives the second inside-substrate-surface information imprint recipe from the imprint recipe creating device according to  claim 1 , 
 obtains a range of each shot area inside the substrate surface based on shot size information indicating a size of one shot of the imprinting and the shot position information, 
 carves the second inside-substrate-surface information by use of the range of each shot area, to create an imprint recipe corresponding to each shot area, 
 drops the imprint material onto the substrate based on the imprint recipe, 
 brings the template into contact with the imprint material, 
 applies light with the template being in the contacted state, to cure the imprint material, and 
 releases the template from the imprint material, to form a pattern. 
 
     
     
       5. An imprint recipe creating system, comprising:
 a memory that stores a set of instructions; and   a hardware processor configured to execute the set of instructions to:
 determine, based on a pattern of a template and information about a thickness of a residual film to be formed by an imprint material, first distribution information for distributing droplets of the imprint material in a shot area; 
 determine, based on the first distribution information, a location of the shot area on a wafer, and edge information of the wafer, second distribution information for distributing droplets of the imprint material in the shot area; 
 determine, based on information related to unevenness of a substrate of the shot area, third distribution information for distributing droplets of the imprint material in the shot area; 
 determine, based on the first, second, and third distribution information, fourth distribution information for distributing droplets of the imprint material in the shot area; 
 create an imprint recipe based on the fourth distribution information; 
 determine the shot area based on shot size information and shot position information; and 
 associate an imprint recipe that includes the fourth distribution information with the determined shot area. 
   
     
     
       6. The system of claim 5, wherein the first distribution information is determined based on an amount of the imprint material that fills the inside of the pattern of the template. 
     
     
       7. The system of claim 5, wherein the thickness of the residual film is based on a distance between the template and the substrate when the template is pressed against the imprint material. 
     
     
       8. The system of claim 5, wherein the first distribution information includes a distribution of density of the droplets that corresponds to a distribution of depressed portions of the pattern. 
     
     
       9. The system of claim 5, wherein the second distribution information is determined by the hardware processor being configured to execute the set of instructions to:
 determine, based on the location of the shot area on a wafer and the edge information of the wafer, whether the shot area is a partial shot;   after determining that the shot area is a partial shot:
 determine a region of the shot area that is outside an edge of the wafer, 
 adjust the first distribution information such that the imprint material is not dropped to the determined region, and 
 provide the adjusted first distribution information as the second distribution information. 
   
     
     
       10. The system of claim 5, wherein the information related to unevenness of a substrate includes one or more locations of one or more depressed portions in the substrate. 
     
     
       11. The system of claim 10, wherein the information related to unevenness of a substrate includes one or more depths of the one or more depressed portions. 
     
     
       12. An imprint recipe creating method, comprising:
 determining, based on a pattern of a template and information about a thickness of a residual film to be formed by an imprint material, first distribution information for distributing droplets of the imprint material in a shot area;   determining, based on the first distribution information, a location of the shot area on a wafer, and edge information of the wafer, second distribution information for distributing droplets of the imprint material in the shot area;   determining, based on information related to an unevenness in a substrate of the shot area, third distribution information for distributing droplets of the imprint material in the shot area;   determining, based on the first, second, and third distribution information, fourth distribution information for distributing droplets of the imprint material in the shot area;   creating an imprint recipe based on the fourth distribution information;   determining the shot area based on shot size information and shot position information; and   associating an imprint recipe that includes the fourth distribution information with the determined shot area.   
     
     
       13. The method of claim 12, wherein the first distribution information is determined based on an amount of the imprint material that fills the inside of the pattern of the template. 
     
     
       14. The method of claim 12, wherein the thickness of the residual film is based on a distance between the template and the substrate when the template is pressed against the imprint material. 
     
     
       15. The method of claim 12, wherein the first distribution information includes a distribution of density of the droplets that corresponds to a distribution of depressed portions of the pattern. 
     
     
       16. The method of claim 12, wherein determining the second distribution information comprises:
 determining, based on the location of the shot area on a wafer and the edge information of the wafer, whether the shot area is a partial shot;   after determining that the shot area is a partial shot:
 determining a region of the shot area that is outside an edge of the wafer, 
 adjusting the first distribution information such that the imprint material is not dropped to the determined region, and 
 providing the adjusted first distribution information as the second distribution information. 
   
     
     
       17. The method of claim 12, wherein the information related to unevenness of a substrate includes one or more locations of one or more depressed portions in the substrate. 
     
     
       18. The method of claim 17, wherein the information related to unevenness of a substrate includes one or more depths of the one or more depressed portions. 
     
     
       19. An imprinting method, comprising:
 applying an imprint material on a substrate surface based on an imprint material recipe, the imprint material recipe created by obtaining a range of each shot area inside the substrate surface based on shot size information indicating a size of one imprinted shot and shot position information, and carving surface information using the range of each shot area, the surface information including distribution information for distributing droplets of the imprint material over a shot area on a wafer, wherein the distribution information is based on: a pattern of a template, a thickness of residual film to be formed by the imprint material on the wafer, a location of the shot area on the wafer, edge information of the wafer, and information related to unevenness of a substrate in the shot area;   causing the template to press against the imprint material on the substrate;   applying light through the template to cure the imprint material, wherein the cured imprint material forms a mask pattern;   etching the substrate based on the mask pattern; and   removing the mask pattern.   
     
     
       20. The method of claim 19, wherein the distribution information is determined based on an amount of the imprint material that fills the inside of the pattern of the template. 
     
     
       21. The method of claim 19, wherein the thickness of the residual film is based on a distance between the template and the substrate when the template is pressed against the imprint material. 
     
     
       22. The method of claim 19, wherein the distribution information includes a distribution of density of the droplets that correspond to a distribution of depressed portions of the pattern. 
     
     
       23. The method of claim 19, wherein the information related to unevenness of a substrate include one or more locations of one or more depressed portions in the substrate. 
     
     
       24. The method of claim 23, wherein the information related to unevenness of a substrate include one or more depths of the one or more depressed portions. 
     
     
       25. A semiconductor device manufacturing method including the imprint method of claim 19.

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