Interconnect devices for electronic packaging assemblies

Abstract

An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element.

The invention claimed is: 
     
       1. An electronic packaging assembly, comprising:
 a semiconductor integrated circuit device; 
 a plurality of interconnect components operatively coupled to the semiconductor integrated circuit device, wherein one or more interconnect components comprise:
 at least one support element having a first surface and a second surface; and 
 a first and a second nano-spring elements each having a first end and a second end, and wherein first ends of the first and the second nano-spring elements are coupled to the first surface and the first end of the first nano-spring element is coupled to the first surface of one support element and the first end of the second nano-spring element is coupled to the second surface of a same the one support element and, wherein said nano-spring elements are less than 10 microns in one dimension; 
 
 wherein the at least one support element comprises a pillar structure, a bump structure, a tubular structure, a columnar structure, or combinations thereof. 
 
     
     
       2. The electronic packaging assembly of  claim 1 , wherein the at least one support elements element and the first and second nano-spring elements are made of electrically and thermally conductive materials. 
     
     
       3. The electronic packaging assembly of  claim 1 , further comprising a coupling layer disposed on at least one of the first surface and, the second surface of the one support element, wherein the coupling layer is configured to couple the first surface or the second surface of the one support element to the first end of the first nano-spring spring element or the first end of the second nano-spring element. 
     
     
       4. The electronic packaging assembly of  claim 1 , wherein the second end ends of the first and the second nano-spring elements comprises comprise a cap. 
     
     
       5. The electronic packaging assembly of  claim 1 , wherein the support element comprise a pillar structure, a bump structure, a tubular structure, a columnar structure, or combinations thereof. 
     
     
       6. The electronic packaging assembly of  claim 1 , wherein two one or more spring additional nano-spring elements nano-spring are coupled to the first surface or the second surface of a respective support element. 
     
     
       7. The electronic packaging assembly of  claim 1 , wherein the first and second nano-spring elements comprise an average diameter of equal to or less than about 550 nm. 
     
     
       8. The electronic packaging assembly of  claim 1 , wherein the semiconductor integrated circuit device comprises a light emitting diode, a laser, or both. 
     
     
       9. The electronic packaging assembly of  claim 1 , wherein the at least one support element comprises a cylindrical element having a diamater of the support element diameter that is about 50% of a pitch of the plurality of interconnect device components. 
     
     
       10. An electronic packaging assembly, comprising:
 a semiconductor device; 
 an interconnect device operatively coupled to the semiconductor device, wherein the interconnect device comprises a plurality of interconnect components, wherein one two or more of the plurality of interconnect components comprise each comprises:
 a plurality of support elementsat least one support element, wherein each support element of the plurality of support elementsat least one support element comprises a first surface and a second surface; and 
 a plurality of nano-spring elements, wherein each nano-spring element of the plurality of nano-spring elements comprises a first end and a second end, and wherein a first and a second nano-spring element of the plurality of nano-spring elements are is coupled to the first surface and of one support element, and wherein a second nano-spring element of the plurality of nano-spring elements is coupled to the second surface of the one support element; and 
 
 an external article operatively coupled to the interconnect device such that the plurality of interconnect components of the interconnect device extend between the semiconductor device and the external article; 
 wherein the at least one support element of a respective interconnect component of the two or more of the plurality of interconnect components is separate from the at least one support element of another respective interconnect component of the two or more of the plurality of interconnect components. 
 
     
     
       11. The electronic packaging assembly of  claim 10 , further comprising wherein the semiconductor device comprises an integrated interconnect circuit, wherein the integrated interconnect circuit comprises a flip chip, a ball grid array, a multi chip module, a stacked die, or combinations thereof. 
     
     
       12. The electronic packaging assembly of  claim 11 , wherein the stacked die comprises vertically stacked die. 
     
     
       13. The electronic packaging assembly of  claim 10 , wherein the semiconductor device comprises a microprocessor, a microprocessor integrated circuit, a semiconductor integrated circuit, a laser, a light emitting diode, or combinations thereof. 
     
     
       14. The electronic packaging assembly of  claim 13 , further comprising an integrated interconnect circuit, wherein the integrated interconnect circuit is disposed between the interconnect device and the semiconductor device, or the interconnect device and the external article, or both. 
     
     
       15. The electronic packaging assembly of  claim 10 , wherein the interconnect device further comprises other spring elements, bumps, micro-bumps, underfill material, or combinations thereof. 
     
     
       16. The electronic packaging assembly of  claim 10 , wherein the interconnect device further comprises a coupling layer disposed on the second end ends of the first and second nano-spring elements. 
     
     
       17. An electronic packaging assembly comprising:
 a semiconductor device;   an external article;   a plurality of interconnect components disposed between the semiconductor device and the external article, wherein two or more of the plurality of interconnect components each comprises:
 at least one support element; and 
 at least one spring element coupled to the at least one support element; and 
   at least one interface layer disposed between the plurality of interconnect components and the semiconductor device;   wherein the at least one support element of a respective interconnect component of the two or more of the plurality of interconnect components is separate from the at least one support element of another respective interconnect component of the two or more of the plurality of interconnect components.   
     
     
       18. The electronic packaging assembly of claim 17 wherein each of the plurality of interconnect components are coupled to a respective pad of the at least one interface layer. 
     
     
       19. The electronic packaging assembly of claim 17 further comprising at least another interface layer disposed between the plurality of interconnect components and the external article. 
     
     
       20. The electronic packaging assembly of claim 17 wherein the at least one interface layer is configured to facilitate coupling, thermal conductivity, electrical conductivity, or combinations thereof between the plurality of interconnect components and the semiconductor device. 
     
     
       21. The electronic packaging assembly of claim 17 wherein the at least one interface layer comprises an electrically and thermally conductive adhesive material. 
     
     
       22. An electronic packaging assembly comprising:
 a light emitting device;   a first interconnect device comprising a first plurality of interconnect components, at least one of the first plurality of interconnect components comprising:
 a support element having a first surface coupled to the light emitting device so as to be in direct contact therewith; and 
 at least one spring element having a first end coupled to a second surface of the support element; and 
   a substrate coupled to a second end of the at least one spring element.   
     
     
       23. The electronic packaging assembly of claim 22 wherein the light emitting device comprises a light emitting diode. 
     
     
       24. The electronic packaging assembly of claim 22 wherein the light emitting device comprises a laser. 
     
     
       25. The electronic packaging assembly of claim 22 further comprising:
 a thermo-electric cooler; and   a second interconnect device comprising a second plurality of interconnect components;   wherein the substrate is coupled to the second end of the at least one spring element by way of the thermo-electric cooler and the second interconnect device.   
     
     
       26. The electronic packaging assembly of claim 25 wherein the second plurality of interconnect components comprise a plurality of support elements coupled to the thermo-electric cooler and a plurality of spring elements coupling the plurality of support elements to the substrate.