Assignee
COHEN URI
23 granted patents·4 pending applications·172 citations·filing 1977–2016
Top patents by PatentIndex Score
27 records- 0197US7199052B2Seed layers for metallic interconnectsCOHEN URI·Filed 2005·Granted Apr 3, 2007·34 cites·75 claims
- 0288US4923574AMethod for making a record member with a metallic antifriction overcoatCOHEN URI·Filed 1989·Granted May 8, 1990·33 cites·40 claims
- 0387US8603242B2Floating semiconductor foilsCOHEN URI·Filed 2010·Granted Dec 10, 2013·3 cites·29 claims
- 0487US7105434B2Advanced seed layery for metallic interconnectsCOHEN URI·Filed 2004·Granted Sep 12, 2006·23 cites·21 claims
- 0586US7709958B2Methods and structures for interconnect passivationCOHEN URI·Filed 2005·Granted May 4, 2010·12 cites·14 claims
- 0686US6635184B1Method for pattern-etching alumina layers and productsCOHEN URI·Filed 2000·Granted Oct 21, 2003·28 cites·59 claims
- 0783US7682496B2Apparatus for depositing seed layersCOHEN URI·Filed 2006·Granted Mar 23, 2010·5 cites·14 claims
- 0882US7282445B2Multiple seed layers for interconnectsCOHEN URI·Filed 2007·Granted Oct 16, 2007·6 cites·22 claims
- 0979US8685221B1Enhanced electrochemical deposition fillingCOHEN URI·Filed 2012·Granted Apr 1, 2014·2 cites·36 claims
- 1070US8123861B2Apparatus for making interconnect seed layers and productsCOHEN URI·Filed 2010·Granted Feb 28, 2012·1 cites·28 claims
- 1166US9911614B2Methods for activating openings for jets electroplatingCOHEN URI·Filed 2010·Granted Mar 6, 2018·1 cites·15 claims
- 1260US2014197537A1Void-Free Metallic Filled High Aspect Ratio OpeningsCOHEN URI·Filed 2014·Application pending·0 cites
- 1359US9530653B2High speed electroplating metallic conductorsCOHEN URI·Filed 2016·Granted Dec 27, 2016·0 cites·34 claims
- 1459US2014061919A1Electroplated Metallic Interconnects And ProductsCOHEN URI·Filed 2013·Application pending·0 cites
- 1558US9273409B2Electroplated metallic conductorsCOHEN URI·Filed 2015·Granted Mar 1, 2016·0 cites·27 claims
- 1657US10096547B2Metallic interconnects productsCOHEN URI·Filed 2015·Granted Oct 9, 2018·0 cites·29 claims
- 1757US9673090B2Seed layers for metallic interconnectsCOHEN URI·Filed 2009·Granted Jun 6, 2017·0 cites·4 claims
- 1857US8349149B2Apparatus for enhanced electrochemical depositionCOHEN URI·Filed 2007·Granted Jan 8, 2013·0 cites·36 claims
- 1956US8586471B2Seed layers for metallic interconnects and productsCOHEN URI·Filed 2012·Granted Nov 19, 2013·0 cites·28 claims
- 2054US7573133B2Interconnect structures and methods for their fabricationCOHEN URI·Filed 2004·Granted Aug 11, 2009·5 cites·20 claims
- 2154US7550386B2Advanced seed layers for interconnectsCOHEN URI·Filed 2007·Granted Jun 23, 2009·0 cites·6 claims
- 2252US7247563B2Filling high aspect ratio openings by enhanced electrochemical deposition (ECD)COHEN URI·Filed 2005·Granted Jul 24, 2007·0 cites·33 claims
- 2350US4142947AElectrodeposition of polycrystalline silicon from a molten fluoride bath and productCOHEN URI·Filed 1977·Granted Mar 6, 1979·13 cites·19 claims
- 2447US4678722ARecord member with metallic antifriction overcoatCOHEN URI·Filed 1985·Granted Jul 7, 1987·6 cites·28 claims
- 2545US2014331078A1Elastic Space-Based Architecture application system for a cloud computing environmentCOHEN URI·Filed 2013·Application pending·0 cites
- 2645US2010213614A1Methods for Passivating Metallic InterconnectsCOHEN URI·Filed 2010·Application pending·0 cites
- 2742US8501139B2Floating Si and/or Ge foilsCOHEN URI·Filed 2010·Granted Aug 6, 2013·0 cites·28 claims
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