Assignee
DANFOSS SILICON POWER GMBH
DE·40 granted patents·22 pending applications·221 citations·filing 2003–2025
Top patents by PatentIndex Score
62 records- 0197US7835151B2Flow distribution module and a stack of flow distribution modulesDANFOSS SILICON POWER GMBH·Filed 2005·Granted Nov 16, 2010·100 cites·7 claims
- 0295US11532600B2Semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2020·Granted Dec 20, 2022·4 cites·8 claims
- 0394US11400514B2Sintering tool and method for sintering an electronic subassemblyDANFOSS SILICON POWER GMBH·Filed 2020·Granted Aug 2, 2022·3 cites·14 claims
- 0486US11134587B2Power module with integrated cooling deviceDANFOSS SILICON POWER GMBH·Filed 2018·Granted Sep 28, 2021·5 cites·16 claims
- 0585US10999955B2Electronic power system and method for manufacturing the sameDANFOSS SILICON POWER GMBH·Filed 2017·Granted May 4, 2021·8 cites·1 claims
- 0685US7360582B2Flow distributing unit and cooling unit having bypass flowDANFOSS SILICON POWER GMBH·Filed 2004·Granted Apr 22, 2008·44 cites·4 claims
- 0783US10832995B2Power moduleDANFOSS SILICON POWER GMBH·Filed 2019·Granted Nov 10, 2020·3 cites·20 claims
- 0883US10794390B2Modular turbo compressor shaftDANFOSS SILICON POWER GMBH·Filed 2017·Granted Oct 6, 2020·3 cites·20 claims
- 0981US7339788B2Cooling unit and flow distributing element for use in such unitDANFOSS SILICON POWER GMBH·Filed 2003·Granted Mar 4, 2008·30 cites·16 claims
- 1077US10910296B2Lead frame and method of fabricating the sameDANFOSS SILICON POWER GMBH·Filed 2020·Granted Feb 2, 2021·1 cites·7 claims
- 1173US10760583B2Axial bearing arrangement for a drive shaft of a centrifugal compressorDANFOSS SILICON POWER GMBH·Filed 2017·Granted Sep 1, 2020·1 cites·20 claims
- 1272US10079219B2Power semiconductor contact structure and method for the production thereofDANFOSS SILICON POWER GMBH·Filed 2015·Granted Sep 18, 2018·2 cites·18 claims
- 1371US10483229B2Sintering deviceDANFOSS SILICON POWER GMBH·Filed 2015·Granted Nov 19, 2019·2 cites·20 claims
- 1466US7529091B2Power semiconductor module and method for cooling a power semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2005·Granted May 5, 2009·3 cites·16 claims
- 1565US12046584B2Semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 1665US9613929B2Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereofDANFOSS SILICON POWER GMBH·Filed 2016·Granted Apr 4, 2017·1 cites·7 claims
- 1762US10381283B2Power semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2016·Granted Aug 13, 2019·1 cites·13 claims
- 1862US8017446B2Method for manufacturing a rigid power module suited for high-voltage applicationsDANFOSS SILICON POWER GMBH·Filed 2010·Granted Sep 13, 2011·2 cites·8 claims
- 1960US11626383B2Process and device for low-temperature pressure sinteringDANFOSS SILICON POWER GMBH·Filed 2020·Granted Apr 11, 2023·0 cites·3 claims
- 2060US2024316638A1Pressure-sintering method employing deformation uptake meansDANFOSS SILICON POWER GMBH·Filed 2024·Application pending·0 cites
- 2159US12444670B2Power moduleDANFOSS SILICON POWER GMBH·Filed 2021·Granted Oct 14, 2025·0 cites·11 claims
- 2258US2024373578A1Power module and method for manufacturing a power moduleDANFOSS SILICON POWER GMBH·Filed 2024·Application pending·0 cites
- 2357US2024339387A1Semiconductor power moduleDANFOSS SILICON POWER GMBH·Filed 2024·Application pending·0 cites
- 2455US10306800B2Cooling trough, cooler and power module assemblyDANFOSS SILICON POWER GMBH·Filed 2015·Granted May 28, 2019·1 cites·17 claims
- 2555US7040381B2Cooling deviceDANFOSS SILICON POWER GMBH·Filed 2003·Granted May 9, 2006·7 cites·15 claims
- 2654US2024243040A1LeadframeDANFOSS SILICON POWER GMBH·Filed 2022·Application pending·0 cites
- 2751US12424512B2Cooling system comprising a serpentine passagewayDANFOSS SILICON POWER GMBH·Filed 2020·Granted Sep 23, 2025·0 cites·17 claims
- 2850US10814396B2Sintering tool and method for sintering an electronic subassemblyDANFOSS SILICON POWER GMBH·Filed 2015·Granted Oct 27, 2020·0 cites·15 claims
- 2950US10403566B2Power moduleDANFOSS SILICON POWER GMBH·Filed 2016·Granted Sep 3, 2019·0 cites·11 claims
- 3050US2023412167A1Power Electronic Module Comprising a Gate-Source Control UnitDANFOSS SILICON POWER GMBH·Filed 2021·Application pending·0 cites
- 3149US12133366B2Power electronics module with improved coolingDANFOSS SILICON POWER GMBH·Filed 2020·Granted Oct 29, 2024·0 cites·20 claims
- 3249US12125817B2Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each otherDANFOSS SILICON POWER GMBH·Filed 2020·Granted Oct 22, 2024·0 cites·24 claims
- 3349US10796985B2Lead frame and method of fabricating the sameDANFOSS SILICON POWER GMBH·Filed 2017·Granted Oct 6, 2020·0 cites·2 claims
- 3449US2024373604A1Cooler for an electronic component and power module comprising such a coolerDANFOSS SILICON POWER GMBH·Filed 2022·Application pending·0 cites
- 3548US12581983B2Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductorDANFOSS SILICON POWER GMBH·Filed 2020·Granted Mar 17, 2026·0 cites·20 claims
- 3648US12046576B2Pressure sintering device and method for manufacturing an electronic componentDANFOSS SILICON POWER GMBH·Filed 2020·Granted Jul 23, 2024·0 cites·23 claims
- 3748US11776932B2Process and device for low-temperature pressure sinteringDANFOSS SILICON POWER GMBH·Filed 2015·Granted Oct 3, 2023·0 cites·21 claims
- 3847US2024203932A1Power module with improved electrical componentsDANFOSS SILICON POWER GMBH·Filed 2022·Application pending·0 cites
- 3946US2024235411A9Conductor structureDANFOSS SILICON POWER GMBH·Filed 2022·Application pending·0 cites
- 4044US12136585B2Compact power electronics module with increased cooling surfaceDANFOSS SILICON POWER GMBH·Filed 2020·Granted Nov 5, 2024·0 cites·20 claims
- 4144US12087699B2Semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2020·Granted Sep 10, 2024·0 cites·20 claims
- 4244US10607962B2Method for manufacturing semiconductor chipsDANFOSS SILICON POWER GMBH·Filed 2016·Granted Mar 31, 2020·0 cites·11 claims
- 4344US10332858B2Electronic sandwich structure with two parts joined together by means of a sintering layerDANFOSS SILICON POWER GMBH·Filed 2015·Granted Jun 25, 2019·0 cites·20 claims
- 4442US10818633B2Sintering tool for the lower die of a sintering deviceDANFOSS SILICON POWER GMBH·Filed 2015·Granted Oct 27, 2020·0 cites·18 claims
- 4542US10438924B2Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2017·Granted Oct 8, 2019·0 cites·20 claims
- 4642US2016109190A1A flow distribution module with a patterned cover plateDANFOSS SILICON POWER GMBH·Filed 2013·Application pending·0 cites
- 4741US2023253891A1Switching componentsDANFOSS SILICON POWER GMBH·Filed 2021·Application pending·0 cites
- 4840US2021013175A1Method of assembling a semiconductor power module component and a semiconductor power module with such a module component and manufacturing system thereforDANFOSS SILICON POWER GMBH·Filed 2019·Application pending·0 cites
- 4940US2022071066A9Electronic power system and method for manufacturing the sameDANFOSS SILICON POWER GMBH·Filed 2021·Application pending·0 cites
- 5039US2022013371A1Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power moduleDANFOSS SILICON POWER GMBH·Filed 2019·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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