Assignee
FARRAR PAUL A
US·6 granted patents·3 pending applications·21 citations·filing 2004–2012
Top patents by PatentIndex Score
9 records- 0187US8470642B2High density chip packages, methods of forming, and systems including sameFARRAR PAUL A·Filed 2010·Granted Jun 25, 2013·7 cites·20 claims
- 0286US8237254B2Distributed semiconductor device methods, apparatus, and systemsFARRAR PAUL A·Filed 2011·Granted Aug 7, 2012·7 cites·18 claims
- 0374US8498171B2Distributed semiconductor device methods, apparatus, and systemsFARRAR PAUL A·Filed 2012·Granted Jul 30, 2013·3 cites·22 claims
- 0462US8592964B2Apparatus and method for high density multi-chip structuresFARRAR PAUL A·Filed 2006·Granted Nov 26, 2013·1 cites·18 claims
- 0560US2009243106A1Structures and methods to enhance copper metallizationFARRAR PAUL A·Filed 2009·Application pending·0 cites
- 0659US8779596B2Structures and methods to enhance copper metallizationFARRAR PAUL A·Filed 2004·Granted Jul 15, 2014·3 cites·20 claims
- 0752US9147735B2Apparatus and method for controlling diffusionFARRAR PAUL A·Filed 2010·Granted Sep 29, 2015·0 cites·4 claims
- 0848US2006124699A1Micro-C-4 semiconductor die and method for depositing connection sites thereonFARRAR PAUL A·Filed 2006·Application pending·0 cites
- 0946US2006006544A1Method of forming a micro solder ball for use in C4 bonding processFARRAR PAUL A·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →